公开(公告)号：US20230146529A1

公开(公告)日：2023-05-11

申请号：US17974785

申请日：2022-10-27

Applicant: Delta Electronics, Inc.

Inventor： Kun Jiang ,  Xi Liu ,  Jianxin Chen ,  Geguo Men

IPC: H05K3/34 ,  H01F41/02 ,  H05K1/02

CPC classification number: H05K3/3494 ,  H01F41/0206 ,  H05K1/0298

Abstract: The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

公开(公告)号：US20230397382A1

公开(公告)日：2023-12-07

申请号：US18203191

申请日：2023-05-30

Applicant: Delta Electronics, Inc.

Inventor： Kaijian Yang ,  Shaojun Chen ,  Xi Liu ,  Quansong Luo

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20463 ,  H05K7/20509

Abstract: A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.

公开(公告)号：US20240172375A1

公开(公告)日：2024-05-23

申请号：US18372441

申请日：2023-09-25

Applicant: Delta Electronics, Inc.

Inventor： Quansong Luo ,  Yanbing Xia ,  Yanggui Feng ,  Xi Liu ,  Kaijian Yang ,  Liang Jin

IPC: H05K5/00 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K3/328 ,  H05K3/3415 ,  H05K3/3457

Abstract: A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

公开(公告)号：US20230413450A1

公开(公告)日：2023-12-21

申请号：US18198693

申请日：2023-05-17

Applicant: Delta Electronics, Inc.

Inventor： Kun Jiang ,  Xi Liu ,  Xiaodong Chen

IPC: H05K3/36 ,  H05K1/14 ,  H05K3/34 ,  B23K1/00

CPC classification number: H05K3/368 ,  H05K1/144 ,  H05K3/341 ,  H05K3/3494 ,  B23K2101/42 ,  H05K2203/043 ,  H05K2201/042 ,  H05K2201/10984 ,  H05K2201/10734 ,  B23K1/0016

Abstract: An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.

公开(公告)号：US20220208430A1

公开(公告)日：2022-06-30

申请号：US17529173

申请日：2021-11-17

Applicant: Delta Electronics, Inc.

Inventor： Quansong Luo ,  Xi Liu ,  Xueliang Chang ,  Zhengyu Ye ,  Wenhua Li

IPC: H01F27/02 ,  H01F27/24 ,  H01F7/02 ,  H01F41/00

Abstract: The present disclosure provides a power module and a manufacturing method thereof. The power module includes a substrate, an electronic component, a magnetic component and an encapsulation layer. The substrate includes a first surface and a second surface opposite to each other, and a working region. The working region is disposed on the first surface or the second surface. The electronic component is disposed on the substrate. The magnetic component is disposed on the working region and includes a lateral periphery. The encapsulation layer is disposed on the substrate, covers the electronic component and at least partially surrounds the lateral periphery of the magnetic component. A projection of the encapsulation layer on the first surface of the substrate is not overlapped with a projection of the working region on the first surface, and a gap is formed between the encapsulation layer and the lateral periphery of the magnetic component.