公开(公告)号：US20250031307A1

公开(公告)日：2025-01-23

申请号：US18750025

申请日：2024-06-21

Applicant: Delta Electronics, Inc.

Inventor： Zhiwei Wang ,  Quansong Luo ,  Kaijian Yang ,  Zhongwang Yang

IPC: H05K1/14

Abstract: A power module is disclosed and includes an upper surface for receiving multiple input signals, a lower surface for outputting multiple output signals, a top layer circuit board, a bottom layer circuit board and a middle layer. The top layer circuit board includes a first surface and a second surface disposed opposite to each other, and multiple electronic devices. The first surface forms the upper surface, and multiple first signal connection parts are disposed on the first surface for receiving the multiple input signals. The bottom layer circuit board includes a third surface and a fourth surface disposed oppositely. The fourth surface forms the lower surface, and multiple second signal connection parts are disposed on the fourth surface for outputting the multiple output signals. The middle layer is disposed between the top layer circuit board and the bottom layer circuit board.

公开(公告)号：US20230262889A1

公开(公告)日：2023-08-17

申请号：US18096356

申请日：2023-01-12

Applicant: Delta Electronics, Inc.

Inventor： Jianxin Chen ,  Kun Jiang ,  Quansong Luo

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H02M7/00

CPC classification number: H05K1/113 ,  H05K1/0201 ,  H05K3/30 ,  H02M7/003

Abstract: A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.

公开(公告)号：US20230397382A1

公开(公告)日：2023-12-07

申请号：US18203191

申请日：2023-05-30

Applicant: Delta Electronics, Inc.

Inventor： Kaijian Yang ,  Shaojun Chen ,  Xi Liu ,  Quansong Luo

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20463 ,  H05K7/20509

Abstract: A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.

公开(公告)号：US20240172375A1

公开(公告)日：2024-05-23

申请号：US18372441

申请日：2023-09-25

Applicant: Delta Electronics, Inc.

Inventor： Quansong Luo ,  Yanbing Xia ,  Yanggui Feng ,  Xi Liu ,  Kaijian Yang ,  Liang Jin

IPC: H05K5/00 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K3/328 ,  H05K3/3415 ,  H05K3/3457

Abstract: A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

公开(公告)号：US20220208430A1

公开(公告)日：2022-06-30

申请号：US17529173

申请日：2021-11-17

Applicant: Delta Electronics, Inc.

Inventor： Quansong Luo ,  Xi Liu ,  Xueliang Chang ,  Zhengyu Ye ,  Wenhua Li

IPC: H01F27/02 ,  H01F27/24 ,  H01F7/02 ,  H01F41/00

Abstract: The present disclosure provides a power module and a manufacturing method thereof. The power module includes a substrate, an electronic component, a magnetic component and an encapsulation layer. The substrate includes a first surface and a second surface opposite to each other, and a working region. The working region is disposed on the first surface or the second surface. The electronic component is disposed on the substrate. The magnetic component is disposed on the working region and includes a lateral periphery. The encapsulation layer is disposed on the substrate, covers the electronic component and at least partially surrounds the lateral periphery of the magnetic component. A projection of the encapsulation layer on the first surface of the substrate is not overlapped with a projection of the working region on the first surface, and a gap is formed between the encapsulation layer and the lateral periphery of the magnetic component.