公开(公告)号：US20240172375A1

公开(公告)日：2024-05-23

申请号：US18372441

申请日：2023-09-25

Applicant: Delta Electronics, Inc.

Inventor： Quansong Luo ,  Yanbing Xia ,  Yanggui Feng ,  Xi Liu ,  Kaijian Yang ,  Liang Jin

IPC: H05K5/00 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K3/328 ,  H05K3/3415 ,  H05K3/3457

Abstract: A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

公开(公告)号：US20250062065A1

公开(公告)日：2025-02-20

申请号：US18806091

申请日：2024-08-15

Applicant: Delta Electronics, Inc.

Inventor： Shaopeng Han ,  Yanbing Xia ,  Yanggui Feng ,  Shaojun Chen

IPC: H01F27/26 ,  H01F27/06 ,  H01F27/22

Abstract: A magnetic component is disclosed and includes a circuit board and a magnetic core set. The circuit board includes two through holes passing through a first surface and a second surface thereof. The magnetic core set includes an upper magnetic cover and a lower magnetic cover disposed on the first surface and the second surface, respectively. The upper magnetic cover includes two magnetic columns connected to the lower magnetic cover through the two through holes. The upper magnetic cover is thermally coupled to a heat dissipation device, and a volume of the upper magnetic cover is greater than that of the lower magnetic cover. A thermal resistance defined from the upper magnetic cover to the heat dissipation device is smaller than that defined from the lower magnetic cover to the heat dissipation device. It helps to make the overall heat distribution of the magnetic component more uniform.

公开(公告)号：US20220396038A1

公开(公告)日：2022-12-15

申请号：US17833676

申请日：2022-06-06

Applicant: Delta Electronics, Inc.

Inventor： Yanggui Feng ,  Shaojun Chen

IPC: B29C65/54

Abstract: A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.