Power conversion module and magnetic component thereof

    公开(公告)号:US12119158B2

    公开(公告)日:2024-10-15

    申请号:US17409223

    申请日:2021-08-23

    CPC classification number: H01F27/263 H01F27/306

    Abstract: The present disclosure provides a power conversion module including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface opposite to each other. The first magnetic core is embedded in the main body layer and adjacent to the first surface. The second magnetic core is embedded in the main body layer and adjacent to the second surface. The first magnetic core and the second magnetic core are connected to form plural magnetic columns. The conductor is embedded between the first surface and the second surface. The conductor is partially disposed between the plural magnetic columns. The power device layer is disposed on the first surface. The power device layer includes a power device electrically connected to conductor.

    POWER MODULE ASSEMBLY
    2.
    发明公开

    公开(公告)号:US20230397382A1

    公开(公告)日:2023-12-07

    申请号:US18203191

    申请日:2023-05-30

    CPC classification number: H05K7/209 H05K7/20463 H05K7/20509

    Abstract: A power module assembly is disposed on a substrate and dissipates heat generated through the substrate. The power module assembly includes a circuit board, a heat-generating device, a first metal block, a first filling material and a second filling material. The circuit board includes at least one plane. The heat-generating device is disposed on the plane. The first metal block includes a first side and a second side. The first side of the first metal block faces the heat-generating device, and the second side of the first metal block faces the substrate. The first filling material is disposed between the first side of the first metal block and the heat-generating device. The second filling material is disposed between the second side of the first metal block and the substrate.

    POWER MODULE AND POWER DEVICE
    3.
    发明申请

    公开(公告)号:US20250031307A1

    公开(公告)日:2025-01-23

    申请号:US18750025

    申请日:2024-06-21

    Abstract: A power module is disclosed and includes an upper surface for receiving multiple input signals, a lower surface for outputting multiple output signals, a top layer circuit board, a bottom layer circuit board and a middle layer. The top layer circuit board includes a first surface and a second surface disposed opposite to each other, and multiple electronic devices. The first surface forms the upper surface, and multiple first signal connection parts are disposed on the first surface for receiving the multiple input signals. The bottom layer circuit board includes a third surface and a fourth surface disposed oppositely. The fourth surface forms the lower surface, and multiple second signal connection parts are disposed on the fourth surface for outputting the multiple output signals. The middle layer is disposed between the top layer circuit board and the bottom layer circuit board.

    POWER CONVERSION MODULE AND MAGNETIC DEVICE THEREOF

    公开(公告)号:US20220230798A1

    公开(公告)日:2022-07-21

    申请号:US17528982

    申请日:2021-11-17

    Abstract: A magnetic device includes a magnetic core assembly, a first winding and a second winding. The magnetic core assembly includes a top surface, a bottom surface, a first lateral side, a second lateral side, a third lateral side, a fourth lateral side, a middle leg and two lateral legs. A first winding groove is defined by the middle leg and one lateral leg. A second winding groove is defined by the middle leg and the other lateral leg. Two opposite ends of the first winding groove are respectively exposed to the first lateral side and the fourth lateral side. Two opposite ends of the second winding groove are respectively exposed to the second lateral side and the third lateral side. At least a part of the first winding is disposed within the first winding groove. At least a part of the second winding is disposed within the second winding groove.

    POWER CONVERSION MODULE AND MAGNETIC COMPONENT THEREOF

    公开(公告)号:US20220102054A1

    公开(公告)日:2022-03-31

    申请号:US17409223

    申请日:2021-08-23

    Abstract: The present disclosure provides a power conversion module including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface opposite to each other. The first magnetic core is embedded in the main body layer and adjacent to the first surface. The second magnetic core is embedded in the main body layer and adjacent to the second surface. The first magnetic core and the second magnetic core are connected to form plural magnetic columns. The conductor is embedded between the first surface and the second surface. The conductor is partially disposed between the plural magnetic columns. The power device layer is disposed on the first surface. The power device layer includes a power device electrically connected to conductor.

    POWER CONVERSION MODULE AND MAGNETIC COMPONENT THEREOF

    公开(公告)号:US20250006415A1

    公开(公告)日:2025-01-02

    申请号:US18883864

    申请日:2024-09-12

    Abstract: The present disclosure provides a power conversion module including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface opposite to each other. The first magnetic core is embedded in the main body layer and adjacent to the first surface. The second magnetic core is embedded in the main body layer and adjacent to the second surface. The first magnetic core and the second magnetic core are connected to form plural magnetic columns. The conductor is embedded between the first surface and the second surface. The conductor is partially disposed between the plural magnetic columns. The power device layer is disposed on the first surface. The power device layer includes a power device electrically connected to conductor.

    METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND ELECTRONIC DEVICE

    公开(公告)号:US20240172375A1

    公开(公告)日:2024-05-23

    申请号:US18372441

    申请日:2023-09-25

    CPC classification number: H05K5/0069 H05K3/328 H05K3/3415 H05K3/3457

    Abstract: A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.

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