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    Electronic assembly with integrated IO and power contacts
    1.
    发明申请
    Electronic assembly with integrated IO and power contacts 失效
    具有集成IO和电源触点的电子组件

    公开(公告)号：US20050212120A1

    公开(公告)日：2005-09-29

    申请号：US10810957

    申请日：2004-03-26

    Applicant: Donald Tran

    Inventor： Donald Tran

    IPC: H01L23/02 ,  H01L23/10 ,  H01L23/50 ,  H01L23/52 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K7/10

    CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

    Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

    Abstract translation: 在一些示例性实施例中，集成电路，电子组件和方法提供用于向处理器供电的电流路径。 作为示例，集成电路包括具有从基座的上表面延伸的电力触点的基座。 集成电路还包括安装到基座的上表面以将基板电耦合到基座的基板。 模具安装在基板上，使得模具电耦合到基板。 基座上表面上的电源触点接合子板，使得管芯能够通过基座上表面上的电源触点从安装在子板上的电压源接收电力。

    High-power LGA socket
    7.
    发明申请
    High-power LGA socket 有权

    公开(公告)号：US20050164529A1

    公开(公告)日：2005-07-28

    申请号：US11085289

    申请日：2005-03-21

    Applicant: Donald Tran

    Inventor： Donald Tran

    IPC: H01L23/498 ,  H01L23/50 ,  H01R12/00

    CPC classification number: H01L23/50 ,  H01L23/49805 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

    Abstract: A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.

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