公开(公告)号：US20210347010A1

公开(公告)日：2021-11-11

申请号：US17314573

申请日：2021-05-07

Applicant: EBARA CORPORATION

Inventor： Masayoshi ITO ,  Hisanori MATSUO ,  Itsuki KOBATA ,  Takuya MORIURA

IPC: B24B57/02 ,  B24B37/04 ,  B24B37/005 ,  B24B37/10 ,  B24B37/32

Abstract: There is provided an apparatus for polishing, comprising a polishing table configured to support and rotate a polishing pad; a holder configured to hold an object and press the object against the polishing pad; a polishing solution supply device provided with a contact member and configured to supply a polishing solution to an opening in a bottom face of the contact member in a state that the contact member comes into contact with or is adjacent to the polishing pad, thereby spreading the polishing solution on the polishing pad, the polishing solution supply device causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up by the contact member and setting the contact member either in a direction of keeping the dammed up polishing solution on the polishing pad or in a direction of discharging the dammed up polishing solution, according to an angle of the polishing solution supply device with respect to a radial direction of the polishing pad; an arm linked with the polishing solution supply device; a rotating mechanism configured to rotate the polishing solution supply device with respect to the arm; and a controller configured to control the rotating mechanism to change the angle of the polishing solution supply device with respect to the radial direction of the polishing pad and thereby control a discharge amount of the polishing solution by the contact member of the polishing solution supply device.

公开(公告)号：US20210283746A1

公开(公告)日：2021-09-16

申请号：US17193049

申请日：2021-03-05

Applicant: EBARA CORPORATION

Inventor： Takuya MORIURA ,  Hiroshi SOTOZAKI ,  Tadakazu SONE ,  Masayoshi ITO ,  Itsuki KOBATA ,  Hisanori MATSUO ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US20250058431A1

公开(公告)日：2025-02-20

申请号：US18932791

申请日：2024-10-31

Applicant: EBARA CORPORATION

Inventor： Takuya MORIURA ,  Hiroshi SOTOZAKI ,  Tadakazu SONE ,  Masayoshi ITO ,  Itsuki KOBATA ,  Hisanori MATSUO ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US20240227115A1

公开(公告)日：2024-07-11

申请号：US17996952

申请日：2022-05-19

Applicant: EBARA CORPORATION

Inventor： Tetsuya TERADA ,  Hiroshi SOTOZAKI ,  Takuya MORIURA

IPC: B24B37/04 ,  B24B57/02

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: When a polishing liquid is supplied while moving a polishing liquid supply head including a plurality of polishing liquid supply ports above a polishing pad, a uniformity of a polishing liquid supply range is improved. A polishing apparatus 1 includes a polishing table for supporting a polishing pad 100, a polishing head 30 for holding an object, and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes a polishing liquid supply head 41 including a plurality of polishing liquid supply ports 414, a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100, and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 such that the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a first state 450 where the polishing liquid supply head 41 is disposed to be opposed to a center side of the polishing pad 100 and the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a second state 460 where the polishing liquid supply head 41 is disposed to be opposed to an outer edge side of the polishing pad 100 compared with the first state 450.