公开(公告)号：US20240286246A1

公开(公告)日：2024-08-29

申请号：US18441851

申请日：2024-02-14

Applicant: EBARA CORPORATION

Inventor： Masayuki TAMURA ,  Yusuke MOCHIDA ,  Tetsuya TERADA ,  Noriyuki SATO ,  Kuniaki YAMAGUCHI

IPC: B24B41/047 ,  B24B37/005

CPC classification number: B24B41/047 ,  B24B37/005

Abstract: A technique is disclosed that can allow an elastic membrane to be inflated into a desired shape when a workpiece is released from a polishing head, or when the workpiece is held on the polishing head, thereby avoiding excessive stress on the workpiece. The method includes supplying a gas into a first pressure chamber and a second pressure chamber at a first flow rate and a second flow rate regulated by a first flow-rate control valve and a second flow-rate control valve to inflate an elastic membrane of a polishing head when a polished workpiece is released from the polishing head, or when a workpiece to be polished is held on the polishing head. The first pressure chamber and the second pressure chamber are formed by the elastic membrane.

公开(公告)号：US20210283746A1

公开(公告)日：2021-09-16

申请号：US17193049

申请日：2021-03-05

Applicant: EBARA CORPORATION

Inventor： Takuya MORIURA ,  Hiroshi SOTOZAKI ,  Tadakazu SONE ,  Masayoshi ITO ,  Itsuki KOBATA ,  Hisanori MATSUO ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US20250058431A1

公开(公告)日：2025-02-20

申请号：US18932791

申请日：2024-10-31

Applicant: EBARA CORPORATION

Inventor： Takuya MORIURA ,  Hiroshi SOTOZAKI ,  Tadakazu SONE ,  Masayoshi ITO ,  Itsuki KOBATA ,  Hisanori MATSUO ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B37/04

Abstract: There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.

公开(公告)号：US20240227115A1

公开(公告)日：2024-07-11

申请号：US17996952

申请日：2022-05-19

Applicant: EBARA CORPORATION

Inventor： Tetsuya TERADA ,  Hiroshi SOTOZAKI ,  Takuya MORIURA

IPC: B24B37/04 ,  B24B57/02

CPC classification number: B24B37/04 ,  B24B57/02

Abstract: When a polishing liquid is supplied while moving a polishing liquid supply head including a plurality of polishing liquid supply ports above a polishing pad, a uniformity of a polishing liquid supply range is improved. A polishing apparatus 1 includes a polishing table for supporting a polishing pad 100, a polishing head 30 for holding an object, and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes a polishing liquid supply head 41 including a plurality of polishing liquid supply ports 414, a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100, and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 such that the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a first state 450 where the polishing liquid supply head 41 is disposed to be opposed to a center side of the polishing pad 100 and the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a second state 460 where the polishing liquid supply head 41 is disposed to be opposed to an outer edge side of the polishing pad 100 compared with the first state 450.

公开(公告)号：US20240308028A1

公开(公告)日：2024-09-19

申请号：US18605311

申请日：2024-03-14

Applicant: EBARA CORPORATION

Inventor： Noriyuki SATO ,  Masayuki TAMURA ,  Kuniaki YAMAGUCHI ,  Tetsuya TERADA

IPC: B24B57/02 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B53/017

Abstract: A liquid supply device includes a swing arm capable of horizontally swinging above a polishing table, and a plurality of spray nozzles that is arranged in a longitudinal direction of the swing arm and sprays a cleaning fluid onto the polishing table, in which each of the plurality of spray nozzles has a slit-shaped fluid outlet, and a fluid outlet of the spray nozzle closer to a distal end of the swing arm is oriented to have a larger inclination angle with respect to a longitudinal direction of the swing arm in plan view.