公开(公告)号：US20160167960A1

公开(公告)日：2016-06-16

申请号：US14909105

申请日：2014-07-02

Applicant: EPCOS AG

Inventor： Marcel GIESEN ,  Thomas METZGER ,  Phillip EKKELS ,  Ansgar SCHÄUFELE

IPC: B81C1/00

CPC classification number: B81C1/00682 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00666 ,  B81C99/004 ,  G01L9/0073 ,  H04R31/003

Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.

Abstract translation: 一种方法可用于制造微机电换能器。 在单个晶片上产生多个微机电换能器。 每个换能器包括隔膜。 晶片被分成至少第一和第二区域。 建立第一区域的膜片的随机样品的机械张力，并将其与预定的期望值进行比较。 建立第二区域的膜片的随机样品的机械张力，并将其与预定的期望值进行比较。 将第一区域中的膜片的张力调整到预定的期望值，并且将第二区域中的膜片的张力调整到预定的期望值。

公开(公告)号：US20150380634A1

公开(公告)日：2015-12-31

申请号：US14766674

申请日：2014-02-27

Applicant: EPCOS AG

Inventor： Gudrun HENN ,  Thomas METZGER

IPC: H01L41/053 ,  H05K3/30 ,  H05K13/00

CPC classification number: H01L41/0533 ,  H03H9/0547 ,  H05K3/30 ,  H05K13/00

Abstract: A component suitable for miniaturization and comprising acoustically decoupled functional structures is specified. The component comprises a first functional structure, a first thin-film cover, which covers the first functional structure, and a second functional structure above the thin-film cover. The thin-film cover does not touch the first functional structure.

Abstract translation: 规定适用于小型化并包括声学去耦功能结构的部件。 该部件包括第一功能结构，覆盖第一功能结构的第一薄膜盖和薄膜盖上方的第二功能结构。 薄膜盖不接触第一功能结构。

公开(公告)号：US20160336918A1

公开(公告)日：2016-11-17

申请号：US15112153

申请日：2014-01-15

Applicant: EPCOS AG

Inventor： Ulrich KNAUER ,  Matthias HONAL ,  Charles BINNINGER ,  Thomas METZGER ,  Masahiro NAKANO ,  Hirohiko KAMIMURA ,  Atsushi IIJIMA

IPC: H03H9/64

CPC classification number: H03H9/64 ,  H03H3/02 ,  H03H3/08 ,  H03H9/131 ,  H03H9/14541

Abstract: The present invention concerns an electroacoustic filter (1), comprising an electrode (2) having a main layer (6) which consists of a metallic material comprising an alloy of copper and molybdenum. According to a second aspect, the present invention concerns a method of manufacturing an electroacoustic filter (1), comprising the steps of: providing a substrate (3), sputtering a metallic material comprising an alloy of copper and molybdenum onto the substrate (3), annealing the metallic material, and pattering the metallic material to form a main layer (6) of an electrode (2).

Abstract translation: 本发明涉及一种电声滤波器（1），其包括具有由包含铜和钼的合金的金属材料构成的主层（6）的电极（2）。 根据第二方面，本发明涉及一种制造电声滤波器（1）的方法，包括以下步骤：提供衬底（3），将包含铜和钼的合金的金属材料溅射到衬底（3）上， 退火所述金属材料，并且对所述金属材料进行图案以形成电极（2）的主层（6）。

公开(公告)号：US20180013055A1

公开(公告)日：2018-01-11

申请号：US15546229

申请日：2015-12-18

Applicant: EPCOS AG

Inventor： Thomas METZGER ,  Jürgen PORTMANN

IPC: H01L41/053 ,  H01L41/23 ,  H01L41/047 ,  H01L41/08

Abstract: A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.