公开(公告)号：US20240064907A1

公开(公告)日：2024-02-22

申请号：US18271754

申请日：2022-02-22

Applicant: FICT LIMITED

Inventor： Taiji Sakai ,  Kenji Iida ,  Norikazu Ozaki ,  Kenji Takano ,  Takashi Nakagawa ,  Takayuki Inaba ,  Tetsuro Miyagawa ,  Akira Yajima ,  Shin Hirano ,  Kota Aoi ,  Yoichi Abe ,  Mio Emura

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0201 ,  H05K1/0274 ,  H05K3/4644 ,  H05K2201/10121 ,  H05K2201/0175 ,  H05K2201/062 ,  H05K2201/10984 ,  H05K2201/0129 ,  H05K2201/09545 ,  H05K2201/096

Abstract: An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).