公开(公告)号：US09573799B2

公开(公告)日：2017-02-21

申请号：US14290297

申请日：2014-05-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Andrew C. McNeil ,  Yizhen Lin ,  Lisa Z. Zhang

IPC: H01L27/14 ,  B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  B81B7/02 ,  H01L21/66 ,  H01L21/683

CPC classification number: B81B3/0056 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2203/058 ,  B81B2203/06 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0831 ,  H01L21/6835 ,  H01L22/34 ,  H01L2924/1461 ,  Y10T29/49156

Abstract: A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).

Abstract translation: MEMS器件（40）包括基部结构（42）和悬挂在结构（42）上方的微结构（44）。 基底结构（42）包括形成在基底（48）上的氧化物层（50），形成在氧化物层（50）上的结构层（54）和形成在结构层（54）上的绝缘层 ）。 牺牲层（112）形成在基部结构（42）上方，并且微结构（44）形成在牺牲层（112）上方的另一个结构层（116）中。 方法（90）需要去除牺牲层（112）和氧化物层（50）的一部分以释放微结构（44）并暴露衬底（48）的顶表面（52）。 在移除之后，在微结构（44）和顶表面（52）之间产生的间隙（80）的宽度（86）大于在微结构（44）和微结构（44）之间产生的间隙（84）的宽度（88） 结构层（54）。

公开(公告)号：US09506756B2

公开(公告)日：2016-11-29

申请号：US13833290

申请日：2013-03-15

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Andrew C. McNeil ,  Yizhen Lin

IPC: G01C19/00 ,  G01C19/5712

CPC classification number: G01C19/5712

Abstract: A microelectromechanical systems (MEMS) device includes at least two rate sensors (20, 50) suspended above a substrate (30), and configured to oscillate parallel to a surface (40) of the substrate (30). Drive elements (156, 158) in communication with at least one of the rate sensors (20, 50) provide a drive signal (168) exhibiting a drive frequency. One or more coupling spring structures (80, 92, 104, 120) interconnect the rate sensors (20, 50). The coupling spring structures enable oscillation of the rate sensors (20, 50) in a drive direction dictated by the coupling spring structures. The drive direction for the rate sensors (20) is a rotational drive direction (43) associated with a first axis (28), and the drive direction for the rate sensors (50) is a translational drive direction (64) associated with a second axis (24, 26) that is perpendicular to the first axis (28).

Abstract translation: 微机电系统（MEMS）装置包括悬置在衬底（30）上方的至少两个速率传感器（20,50），并且被配置为平行于衬底（30）的表面（40）振荡。 与速率传感器（20,50）中的至少一个通信的驱动元件（156,158）提供具有驱动频率的驱动信号（168）。 一个或多个耦合弹簧结构（80,92,104,120）互连速率传感器（20,50）。 联接弹簧结构使得速率传感器（20,50）在联接弹簧结构所规定的驱动方向上能够振荡。 速率传感器（20）的驱动方向是与第一轴线（28）相关联的旋转驱动方向（43），速率传感器（50）的驱动方向是与第二轴线（28）相关联的平移驱动方向 轴线（24,26），其垂直于第一轴线（28）。

公开(公告)号：US09335170B2

公开(公告)日：2016-05-10

申请号：US13687299

申请日：2012-11-28

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Yizhen Lin ,  Jan Mehner ,  Michael Naumann

IPC: G01C19/00 ,  G01C19/574

CPC classification number: G01C19/574

Abstract: An inertial sensor (110) includes a drive system (118) configured to oscillate a drive mass (114) within a plane (24) that is substantially parallel to a surface (50) of a substrate (28). The drive system (118) includes first and second drive units (120, 122) having fixed fingers (134, 136) interleaved with movable fingers (130, 132) of the drive mass (114). At least one of the drive units (120) is located on each side (126, 128) of the drive mass (114). Likewise, at least one of the drive units (122) is located on each side (126, 128) of the drive mass (114). The drive units (122) are driven in phase opposition to the drive units (120) so that a levitation force (104) generated by the drive units (122) compensates for, or at least partially suppresses, a levitation force (100) generated by the drive units (120).

Abstract translation: 惯性传感器（110）包括驱动系统（118），驱动系统（118）被配置为使基本平行于基底（28）的表面（50）的平面（24）内的驱动质量块（114）振荡。 驱动系统（118）包括具有与驱动质量块（114）的活动指状物（130,132）交错的固定指状物（134,136）的第一和第二驱动单元（120,122）。 驱动单元（120）中的至少一个位于驱动块（114）的每一侧（126,128）上。 类似地，驱动单元（122）中的至少一个位于驱动块（114）的每一侧（126,128）上。 驱动单元（122）与驱动单元（120）相反地驱动，使得由驱动单元（122）产生的悬浮力（104）补偿或至少部分地抑制产生的悬浮力（100） 通过驱动单元（120）。

公开(公告)号：US09090455B2

公开(公告)日：2015-07-28

申请号：US14450870

申请日：2014-08-04

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Mark E. Schlarmann ,  Yizhen Lin

IPC: B81B7/00 ,  B81C1/00 ,  G01L9/00 ,  G01L19/14 ,  B81B3/00

CPC classification number: B81B7/0048 ,  B81B3/0021 ,  B81B3/0072 ,  B81B7/0058 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/051 ,  B81B2207/115 ,  B81C1/00309 ,  G01L9/0042 ,  G01L9/0052 ,  G01L19/147 ,  H01L2224/48137

Abstract: An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate overlying the device. A trench (54) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform (48) at which the diaphragm resides. The MEMS die is suspended above a substrate (26) so that a clearance space (60) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment (68) via the aperture, the clearance space, and an external port.

Abstract translation: 组件（20）包括具有形成在基板（44）上的压力换能器装置（40）和盖层（38）的MEMS管芯（22）。 包装工艺（74）需要在基板上形成装置（40），通过装置（40）的隔膜（46）下面的基板的后侧（58）产生孔（70），并且将帽 层（38）到覆盖该器件的衬底的前侧。 产生延伸穿过盖层和衬底的沟槽（54），并且沟槽围绕隔膜所在的悬臂平台（48）。 MEMS模具悬挂在基板（26）上方，使得在悬臂平台和基板之间形成间隙空间（60）。 隔膜经由孔，间隙空间和外部端口暴露于外部环境（68）。

公开(公告)号：US09476711B2

公开(公告)日：2016-10-25

申请号：US13924880

申请日：2013-06-24

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Yizhen Lin

IPC: G01C19/5762 ,  G01C19/5712 ,  G01C19/5726 ,  G01C19/574 ,  G01C19/5747

CPC classification number: G01C19/5712 ,  G01C19/5726 ,  G01C19/574 ,  G01C19/5747 ,  G01C19/5762

Abstract: An angular rate sensor includes a substrate, a drive mass flexibly coupled to the substrate, and a sense mass suspended above the substrate and flexibly coupled to the drive mass via flexible support elements. An electrode structure is mechanically coupled to, but electrically isolated from, the drive mass and is spaced apart from the substrate so that it is not in contact with the substrate. The electrode structure is configured to produce a signal that indicates movement of the sense mass relative to the electrode when the sensor is subjected to angular velocity. When the angular rate sensor experiences quadrature error, the drive mass, the sense mass, and the electrode structure move together relative to the sense axis. Since the sense mass and the electrode structure move together in response to quadrature error, there is little relative motion between the sense mass and the electrode structure so that quadrature error is largely eliminated.

Abstract translation: 角速率传感器包括基板，柔性地联接到基板的驱动质量块和悬挂在基板上方的感测块，并通过柔性支撑元件灵活地联接到驱动块。 电极结构被机械耦合到驱动质量体上但与之隔离，并且与衬底间隔开，使得其不与衬底接触。 电极结构被配置为当传感器经受角速度时产生指示感测质量相对于电极的移动的信号。 当角速率传感器遇到正交误差时，驱动质量，感测质量和电极结构相对于感测轴线一起移动。 由于感应质量和电极结构响应于正交误差一起移动，感测质量和电极结构之间几乎没有相对运动，从而大大消除了正交误差。

公开(公告)号：US09194704B2

公开(公告)日：2015-11-24

申请号：US13798902

申请日：2013-03-13

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Yizhen Lin ,  Dejan Mijuskovic

IPC: G01C19/56 ,  G01C19/5747

CPC classification number: G01C19/5747 ,  Y10T29/49002

Abstract: An angular rate sensor (20) includes a single drive mass (24) and distributed sense masses (36, 38, 40, 42) located within a central opening (30) of the drive mass (24). The drive mass (24) is enabled to rotate around the Z-axis (64) under electrostatic stimulus. The sense masses (36, 38, 40, 42) are coupled to the drive mass by spring elements (44, 46, 48, 50) such that oscillatory rotary motion (90) of the drive mass imparts a linear drive motion (92, 94) on the sense masses. The distributed sense masses form two pairs of sense masses, where one pair senses X- and Z-axis angular rate and the other pair senses Y- and Z-axis angular rate. The sense masses are coupled to one another via a centrally located coupler element (34) to ensure that the sense masses of each pair are moving in anti-phase.

Abstract translation: 角速率传感器（20）包括位于驱动质量块（24）的中心开口（30）内的单个驱动质量（24）和分布式感测质量（36,38,40,42）。 驱动质量（24）能够在静电刺激下绕Z轴（64）旋转。 感测质量块（36,38,40,42）通过弹簧元件（44,46,48,50）联接到驱动质量块，使得驱动组件的振动旋转运动（90）施加线性驱动运动（92， 94）关于感觉群众。 分布感知质量形成两对感觉质量，其中一对感测X轴和Z轴角速度，另一对感测Y轴和Z轴角速率。 感测质量通过中心定位的耦合器元件（34）彼此耦合，以确保每对的感测质量在反相中移动。

公开(公告)号：US09190937B2

公开(公告)日：2015-11-17

申请号：US13760465

申请日：2013-02-06

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Yizhen Lin ,  Andrew C. McNeil ,  Mark E. Schlarmann

IPC: G01P15/125 ,  H02N1/00 ,  B81C1/00

CPC classification number: H02N1/006 ,  B81B2201/0235 ,  B81B2203/058 ,  B81C1/00976

Abstract: A MEMS device (20) includes a movable element (20) suspended above a substrate (22) by a spring member (34) having a spring constant (104). A spring softening voltage (58) is applied to electrodes (24, 26) facing the movable element (20) during a powered mode (100) to decrease the stiffness of the spring member (34) and thereby increase the sensitivity of the movable element (32) to an input stimulus (46). Upon detection of a stiction condition (112), the spring softening voltage (58) is effectively removed to enable recovery of the movable element (32) from the stiction condition (112). A higher mechanical spring constant (104) yields a stiffer spring (34) having a larger restoring force (122) in the unpowered mode (96) in order to enable recovery from the stiction condition (112). A feedback voltage (56) can be applied to feedback electrodes (28, 30) facing the movable element (32) to provide electrical damping.

Abstract translation: MEMS器件（20）包括通过具有弹簧常数（104）的弹簧构件（34）悬挂在衬底（22）上方的可移动元件（20）。 在动力模式（100）期间，弹簧软化电压（58）施加到面向可移动元件（20）的电极（24,26），以降低弹簧构件（34）的刚度，从而增加可动元件 （32）到输入激励（46）。 在检测到静态条件（112）时，有效地去除弹簧软化电压（58），以使可移动元件（32）能够从静止状态（112）恢复。 更高的机械弹簧常数（104）产生在无动力模式（96）中具有较大恢复力（122）的更硬的弹簧（34），以便能够从静止状态（112）恢复。 可以将反馈电压（56）施加到面向可移动元件（32）的反馈电极（28,30）以提供电阻尼。

公开(公告)号：US10107701B2

公开(公告)日：2018-10-23

申请号：US15051275

申请日：2016-02-23

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Andrew C. McNeil ,  Yizhen Lin

IPC: G01L9/00 ,  G01L9/12 ,  B60C23/04

Abstract: A MEMS pressure sensor device is provided that can provide both a linear output with regard to external pressure, and a differential capacitance output so as to improve the signal amplitude level. These benefits are provided through use of a rotating proof mass that generates capacitive output from electrodes configured at both ends of the rotating proof mass. Sensor output can then be generated using a difference between the capacitances generated from the ends of the rotating proof mass. An additional benefit of such a configuration is that the differential capacitance output changes in a more linear fashion with respect to external pressure changes than does a capacitive output from traditional MEMS pressure sensors.