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    HEAT SINK AND ELECTRONIC APPARATUS
    2.
    发明公开
    HEAT SINK AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20230240046A1

    公开(公告)日：2023-07-27

    申请号：US17977037

    申请日：2022-10-31

    Applicant: Fujitsu Limited

    Inventor： Kenji Sasabe ,  Hideo Kubo ,  Keita Hirai ,  Atsushi Endo ,  Masahide Kodama ,  Nobumitsu Aoki ,  Yuki Kanai ,  Takashi Urai

    IPC: H05K7/20

    CPC classification number: H05K7/2039 ,  H05K7/20154

    Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.

    Electronic apparatus and cooling module mounted in that electronic apparatus
    5.
    发明授权
    Electronic apparatus and cooling module mounted in that electronic apparatus 有权
    安装在该电子设备中的电子设备和冷却模块

    公开(公告)号：US09223362B2

    公开(公告)日：2015-12-29

    申请号：US14028963

    申请日：2013-09-17

    Applicant: FUJITSU LIMITED

    Inventor： Masayuki Watanabe ,  Kenji Sasabe ,  Eiji Wajima ,  Masumi Suzuki ,  Michimasa Aoki

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: G06F1/20 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20772 ,  H01L2924/00

    Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

    Abstract translation: 电子设备包括风扇，位于风扇产生的气流下游的电路板，安装在电路板上的至少一个处理器，位于风扇产生的气流下游的散热器，散热器冷却 液体冷却剂，管单元，其包括其中冷却剂流动的受热构件和冷却剂管道，所述热接收构件安装在所述处理器上，以及所述冷却剂管道使所述液体冷却剂在所述散热器和所述受热构件之间循环， 其上安装有存储器封装的至少一个存储器板，所述存储器板安装在所述电路板上，并且所述存储器板和所述管单元沿着垂直于所述风扇吹扫所述气流的方向的方向布置。

    HEAT-RECEIVER, COOLING UNIT AND ELECTRONIC DEVICE
    6.
    发明申请
    HEAT-RECEIVER, COOLING UNIT AND ELECTRONIC DEVICE 有权
    热接收器，冷却单元和电子设备

    公开(公告)号：US20150062822A1

    公开(公告)日：2015-03-05

    申请号：US14340739

    申请日：2014-07-25

    Applicant: FUJITSU LIMITED

    Inventor： Michimasa AOKI ,  Masumi Suzuki ,  Jie Wei ,  Fumihiro Tawa ,  Kenji Sasabe

    IPC: H05K7/20

    CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

    Abstract translation: 热接收器包括：第一板，其在一个面处从发热体接收热量; 第二板，其与第一板的另一面相对设置，并且具有比第一板的板厚大的板厚度; 第一联接部，其将所述第一板和所述第二板联接在一起; 以及第二联接部分，其在面对所述第一板朝向所述发热体的位置处将所述第一板和所述第二板联接在一起，所述第二联接部和所述第一联接部之间具有间隙，所述第一联接部通过所述第一联接部 沿着冷却剂通过方向观察，沿着第一板的另一面具有大于第一联接部的宽度的宽度。

    Electronic apparatus and cooling module mounted in that electronic apparatus
    8.
    发明授权
    Electronic apparatus and cooling module mounted in that electronic apparatus 有权

    公开(公告)号：US08564951B1

    公开(公告)日：2013-10-22

    申请号：US13673282

    申请日：2012-11-09

    Applicant: Fujitsu Limited

    Inventor： Masayuki Watanabe ,  Kenji Sasabe ,  Eiji Wajima ,  Masumi Suzuki ,  Michimasa Aoki

    IPC: H05K7/20

    CPC classification number: G06F1/20 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20772 ,  H01L2924/00

    Abstract: An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

    Liquid cooling module
    9.
    发明授权
    Liquid cooling module 有权

    公开(公告)号：US12289860B2

    公开(公告)日：2025-04-29

    申请号：US18104573

    申请日：2023-02-01

    Applicant: Fujitsu Limited

    Inventor： Yuki Kanai ,  Kenji Sasabe ,  Keita Hirai ,  Hideo Kubo ,  Atsushi Endo ,  Masahide Kodama ,  Takashi Urai

    IPC: H05K7/20 ,  G06F1/20

    Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.

    COOLING DEVICE AND COOLING SYSTEM
    10.
    发明申请
    COOLING DEVICE AND COOLING SYSTEM 有权

    公开(公告)号：US20250056765A1

    公开(公告)日：2025-02-13

    申请号：US18782464

    申请日：2024-07-24

    Applicant: Fujitsu Limited

    Inventor： Hideo Kubo ,  Toru Kobayashi ,  Nobumitsu Aoki ,  Kenji Sasabe ,  Keita Hirai ,  Hiromasa Miyata ,  Hideto Fukushima ,  Masahide Kodama ,  Atsushi Endo ,  Takashi Urai

    IPC: H05K7/20

    Abstract: A cooling device includes a container, a heat receiver to receive heat from a cooling target and evaporate a refrigerant inside the container, a condenser disposed away from the heat receiver, and to condense the gas-phase refrigerant, a liquid transporter to couple the condenser and the heat receiver, and transport the liquid-phase refrigerant to the heat receiver from the condenser, a first transporter to couple the heat receiver and the condenser, and include a first transport-space inside the first transporter, in which the gas-phase refrigerant is transported to the condenser from the heat receiver, and a second transporter provided in pairs over two sides in a direction orthogonal to a moving-direction of the refrigerant in the first transporter, and to couple the heat receiver and the condenser, and include a second transport-space inside the second transporter, in which the gas-phase refrigerant is transported to the condenser from the heat receiver.

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