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公开(公告)号：US20170355592A1
公开(公告)日：2017-12-14
申请号：US15689530
申请日：2017-08-29
Applicant: Foresee Technology Corp.
Inventor： Chien-Chang CHEN , Yi-Der LIANG , Shiao-Yi LIN , Cheng-Kuang YANG
CPC classification number: B81B3/0054 , B81B3/0078 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , B81B2203/0361 , B81B2207/015 , B81B2207/07 , B81C1/00246 , B81C2201/013 , B81C2201/053 , B81C2203/0714 , B81C2203/0735 , H04R19/005 , H04R19/04
Abstract: The present invention disclosed a CMOS sensing component, a CMOS single chip and a method of manufacturing the same. The CMOS single chip comprises a movable film, at least one support pillar, a base metal layer and a circuit integration. The movable film is disposed on a top layer of the CMOS single chip and has a plurality of through-vias. The support pillar is disposed under the movable film to provide a supporting force of the movable film. The base metal layer is formed under the support pillars and isolated from the support pillars, and faces towards the movable film to form a micro capacitor to sense one of the outside sensing signals, the area of the base metal layer larger than the area of the movable film. The circuit integration is formed under the base metal layer, or formed under the base metal layer and on the side of the movable film, and connected to the movable film and the base metal layer, to provide operation voltages to the movable film and the base metal layer, and to receive the outside sensing signal generated sensed by the movable film and the base metal layer and convert the outside sensing signal into an output signal.
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公开(公告)号：US20170313576A1
公开(公告)日：2017-11-02
申请号：US15652960
申请日：2017-07-18
Applicant: Foresee Technology Corp.
Inventor： Chien-Chang CHEN , Yi-Der LIANG , Shiao-Yi LIN , Cheng-Kuang YANG
CPC classification number: B81B3/0054 , B81B3/0078 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , B81B2203/0361 , B81B2207/015 , B81B2207/07 , B81C1/00246 , B81C2201/013 , B81C2201/053 , B81C2203/0714 , B81C2203/0735 , H04R19/005 , H04R19/04
Abstract: The present invention disclosed a micro acoustic collector with a lateral cavity, comprising: a base metal layer; a movable film, an annular side wall; a lateral metal layer. The movable film faces towards the base metal layer to form a hollow space. The lateral metal layer is formed at a side of the movable film and around the movable film, fixed by the annular side wall and spaced apart from peripheral of the movable film by a distance, and the lateral metal layer faces towards the base metal layer to form a lateral cavity to assist an acoustic collection.
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公开(公告)号：US20170313575A1
公开(公告)日：2017-11-02
申请号：US15652920
申请日：2017-07-18
Applicant: Foresee Technology Corp.
Inventor： Chien-Chang CHEN , Yi-Der LIANG , Shiao-Yi LIN , Cheng-Kuang YANG
CPC classification number: B81B3/0054 , B81B3/0078 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0307 , B81B2203/0361 , B81B2207/015 , B81B2207/07 , B81C1/00246 , B81C2201/013 , B81C2201/053 , B81C2203/0714 , B81C2203/0735 , H04R19/005 , H04R19/04
Abstract: The present invention disclosed a micro acoustic collector and CMOS microphone single chip. The micro acoustic collector comprising: a plurality of leaf-shaped structures annularly arranged with symmetry, each of the plurality of leaf-shaped structure having a suspended arm and a restrained arm, and the suspended arm of the plurality of leaf-shaped structures connected to a suspended fulcrum, and a plurality of through-vias formed in the suspended fulcrum and the plurality of leaf-shaped structures; a plurality of support pillars uniformly disposed under edges of the plurality of leaf-shaped structures corresponding to the restrained arms and the suspend arms; and a base metal layer formed under and insulated from the plurality of support pillars, and facing towards the inner-annular-supported acoustic collection film to form a hollow space.
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