公开(公告)号：US09902610B2

公开(公告)日：2018-02-27

申请号：US15155448

申请日：2016-05-16

Applicant: Foresee Technology Corp..

Inventor： Chien-Chan Chen ,  Yi-Der Liang ,  Shiao-Yi Lin ,  Cheng-Kuang Yang

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B3/0054 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0361 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2201/013 ,  B81C2201/053 ,  B81C2203/0714 ,  B81C2203/0735 ,  H04R19/005 ,  H04R19/04

Abstract: A support pillar is formed under a movable film for support. The support pillar includes a plurality of first metal micropillars, a base metal connection pillar layer and a first oxide encapsulation layer. The first metal micropillars are formed under the movable film and conductively connected to the movable film via metal connection. The base metal connection pillar layer is formed under the first metal micropillars and conductively connected to the first metal micropillars. The first oxide encapsulation layer fully or partially encapsulates the first metal micropillars to insulate the first metal micropillars from air, and shape the support pillar into a column shape.