公开(公告)号：US20190185319A1

公开(公告)日：2019-06-20

申请号：US16221457

申请日：2018-12-15

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Xin CHEN ,  Dachuang SHI ,  Jian GAO ,  Zhengping WANG ,  Haidong YANG

IPC: B81C1/00 ,  H01L21/306 ,  H01L29/06

Abstract: A method of processing nano- and micro-pores includes washing a substrate and cleaning a surface of the substrate; spin-coating photoresist, exposing the substrate and developing to form the substrate with a pattern; 3. depositing micro-nano metal particles on the surface of the substrate; wherein the micro-nano metal particles are centered on a magnetic core; and the surface of the magnetic core is plated with a metal nano-particle coating composed of a plurality of gold, silver or aluminum nanoparticles; removing the photoresist, and maintaining dot arrays of the micro-nano metal particles; applying laser irradiation and a strong uniform magnetic field on the substrate, so that the substrate is processed to form processed structures; and after the processed structures being formed into nano-/micro-pores with targeted pore size, shape and depth, stopping the laser irradiation and removing the strong uniform magnetic field.

公开(公告)号：US20190352789A1

公开(公告)日：2019-11-21

申请号：US16383852

申请日：2019-04-15

Applicant: Guangdong University of Technology

Inventor： Yun CHEN ,  Xin CHEN ,  Dachuang SHI ,  Xun CHEN ,  Qiang LIU ,  Jian GAO ,  Chengqiang CUI

IPC: C25D5/02 ,  C25D7/12 ,  C25D3/38 ,  C25D17/00 ,  H01L21/288 ,  H01L21/768

Abstract: A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.

公开(公告)号：US20210166981A1

公开(公告)日：2021-06-03

申请号：US17037849

申请日：2020-09-30

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Yun CHEN ,  Yao YAO ,  Shuquan DING ,  Junyu LONG ,  Maoxiang HOU ,  Dachuang SHI ,  Xin CHEN ,  Jian GAO ,  Qiang LIU ,  Lanyu ZHANG ,  Yunbo HE ,  Shenghui ZHANG ,  Zhengping WANG

IPC: H01L21/66 ,  B23K26/08 ,  B23K26/06 ,  B23K26/082

Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.

公开(公告)号：US20230357016A1

公开(公告)日：2023-11-09

申请号：US18146378

申请日：2022-12-25

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Huilong LIU ,  Yun CHEN ,  Xin CHEN ,  Yixin ZHENG ,  Kyoung-Sik MOON ,  Dachuang SHI ,  Jian GAO ,  Ching-Ping WONG

IPC: C01B32/184 ,  C01B32/196

CPC classification number: C01B32/184 ,  C01B32/196 ,  C01P2004/04 ,  C01P2002/82 ,  C01P2002/85

Abstract: A method for integrally forming a graphene film (GF) of a high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing, includes: selecting a carbon precursor material, where the carbon precursor material is one selected from the group consisting of a biomass/hydrogel composite and a heavy hydrocarbon compound; adding an activator solution to an inside of the carbon precursor material to obtain a composite with an activator uniformly loaded, and spreading the composite on a flexible substrate to form a carbon precursor material layer; heating and drying the carbon precursor material layer; in-situ processing with an ultrafast UV laser to obtain an activated GF of a high SSA; and cleaning and drying the activated GF. With the method of the present disclosure, a microporous activated GF of a high SSA can be directly processed in-situ on a flexible substrate.

公开(公告)号：US20190355587A1

公开(公告)日：2019-11-21

申请号：US16383885

申请日：2019-04-15

Applicant: Guangdong University of Technology

Inventor： Xin CHEN ,  Yun CHEN ,  Dachuang SHI ,  Xun CHEN ,  Qiang LIU ,  Jian GAO ,  Chengqiang CUI

IPC: H01L21/308 ,  H01L21/306

Abstract: A method for synchronous wet etching processing of differential microstructures, including the following steps: step a: performing photoetching on a processing surface of a workpiece to be processed to develop the workpiece; step b: affixing a mask to a surface opposite to the processing surface of the workpiece; step c: continuously cooling the mask; step d: placing the cooled mask and the workpiece in a wet etching device; and adding an etchant to the processing surface of the workpiece to start etching; step e: removing the mask and the workpiece from the wet etching device after the set etching time; separating the mask and the workpiece to obtain a workpiece with a etching structure. A temperature difference is formed between the pattern area to be processed and the retaining area.