LINEAR MOTOR MOTION CONTROL METHOD, DEVICE, EQUIPMENT AND STORAGE MEDIUM

    公开(公告)号:US20240176315A1

    公开(公告)日:2024-05-30

    申请号:US18430513

    申请日:2024-02-01

    CPC classification number: G05B13/042 G05B13/048 H02P25/06

    Abstract: A linear motor motion control method, device, equipment and storage medium. The proposed invention uses an extended state observer constructed in advance based on the model parameters of the linear motor, and performs state estimation based on the total control amount of the linear motor and the actual displacement signal to obtain each observation signal. The phase advance controller is used to improve the estimated lag of the disturbance observation signal, and a model prediction controller built in advance based on the mathematical model of the linear motor is used to perform rolling optimization based on each observation signal to obtain the optimal control amount increment; The total control amount is updated based on the improved disturbance observation signal and the optimal control amount increment, and the corresponding drive signal is output to the drive end of the linear motor based on the updated total control amount.

    METHOD OF PROCESSING NANO- AND MICRO-PORES
    4.
    发明申请

    公开(公告)号:US20190185319A1

    公开(公告)日:2019-06-20

    申请号:US16221457

    申请日:2018-12-15

    Abstract: A method of processing nano- and micro-pores includes washing a substrate and cleaning a surface of the substrate; spin-coating photoresist, exposing the substrate and developing to form the substrate with a pattern; 3. depositing micro-nano metal particles on the surface of the substrate; wherein the micro-nano metal particles are centered on a magnetic core; and the surface of the magnetic core is plated with a metal nano-particle coating composed of a plurality of gold, silver or aluminum nanoparticles; removing the photoresist, and maintaining dot arrays of the micro-nano metal particles; applying laser irradiation and a strong uniform magnetic field on the substrate, so that the substrate is processed to form processed structures; and after the processed structures being formed into nano-/micro-pores with targeted pore size, shape and depth, stopping the laser irradiation and removing the strong uniform magnetic field.

    EJECTOR PIN SLIDING ON MEMBRANE-BASED DEVICE AND METHOD FOR MASS TRANSFER OF MINI LIGHT-EMITTING DIODES (MINI-LEDS)

    公开(公告)号:US20240363793A1

    公开(公告)日:2024-10-31

    申请号:US18769413

    申请日:2024-07-11

    CPC classification number: H01L33/005

    Abstract: An ejector pin sliding on membrane-based device and method for mass transfer of mini light-emitting diodes (Mini-LEDs) are provided. The device includes a gantry transverse beam. The gantry transverse beam is provided with an ejector pin base, and the ejector pin base is configured to move along the gantry transverse beam. The ejector pin base is fixedly provided with a vision camera and an ejector pin. A blue membrane is horizontally provided at a side of the gantry transverse beam close to the ejector pin, and is spaced from the gantry beam. A surface of a side of the blue membrane away from the gantry transverse beam is adhesively provided with a plurality of Mini-LED chips arranged evenly. A transfer substrate is horizontally provided at a side of the blue membrane close to the plurality of Mini-LED chips, and is spaced from the blue membrane.

    VARIABLE PITCH ELECTRONIC COMPONENT MASS TRANSFER APPARATUS AND METHOD

    公开(公告)号:US20210219476A1

    公开(公告)日:2021-07-15

    申请号:US17218367

    申请日:2021-03-31

    Abstract: A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.

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