公开(公告)号：US20150325762A1

公开(公告)日：2015-11-12

申请号：US14695003

申请日：2015-04-23

Applicant: Genesis Photonics Inc.

Inventor： Shou-Wen Hsu ,  Yu-Feng Lin ,  Cheng-Bin Liu ,  Tai-Cheng Tsai ,  Chin-Hua Hung

IPC: H01L33/62 ,  H01L29/866 ,  H01L27/15

CPC classification number: H01L23/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/167 ,  H01L27/15 ,  H01L29/866 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1329 ,  H01L2224/13439 ,  H01L2224/16227 ,  H01L2224/81099 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/81855 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes: a substrate; at least one light emitting diode disposed on the substrate by eutectic bonding; and at least one Zener diode disposed on the substrate by at least one silver glue. The method of manufacturing the package structure includes: providing a substrate; performing a eutectic bonding process to dispose at least one light emitting diode on the substrate; and performing a silver glue bonding process at room temperature to dispose at least one Zener diode on the substrate.

Abstract translation: 公开了一种封装结构及其制造方法。 封装结构包括：衬底; 至少一个发光二极管通过共晶接合设置在基板上; 以及至少一个齐纳二极管，其通过至少一个银胶布置在所述基板上。 制造封装结构的方法包括：提供衬底; 执行共晶接合工艺以在衬底上设置至少一个发光二极管; 并在室温下进行银胶接合处理，以在衬底上设置至少一个齐纳二极管。