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    LIGHT EMITTING DEVICE
    1.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20180049319A1

    公开(公告)日：2018-02-15

    申请号：US15790168

    申请日：2017-10-23

    Applicant: GENESIS PHOTONICS INC.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin ,  Meng-Ting Tsai

    IPC: H05K1/05

    CPC classification number: H05K1/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/3436 ,  H05K2201/10106

    Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

    LIGHT EMITTING MODULE
    2.
    发明申请
    LIGHT EMITTING MODULE 审中-公开

    公开(公告)号：US20180040594A1

    公开(公告)日：2018-02-08

    申请号：US15785399

    申请日：2017-10-16

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/64 ,  H01L33/56

    CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

    LIGHT EMITTING MODULE
    4.
    发明申请
    LIGHT EMITTING MODULE 审中-公开
    发光模块

    公开(公告)号：US20160013166A1

    公开(公告)日：2016-01-14

    申请号：US14737503

    申请日：2015-06-12

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/54 ,  H01L33/50 ,  H01L33/64 ,  H01L33/60

    CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

    Abstract translation: 提供了包括发光器件封装结构和散热结构的发光模块。 发光器件封装结构包括发光器件，图案化反射元件和图案化导电层。 图案化的反射元件设置在发光器件的侧表面周围并且暴露第一焊盘的第一底表面和第二焊盘的第二底表面。 图案化导电层设置在第一焊盘的第一底表面和第二焊盘的第二底表面上。 发光器件通过串联连接，并联连接或通过图案化导电层的串联并联连接彼此电连接。 散热结构设置在发光器件封装结构的下方，并且包括放热单元和布置在散热单元上的图案化电路层。

    Light emitting device
    8.
    发明授权
    Light emitting device 有权

    公开(公告)号：US09801274B2

    公开(公告)日：2017-10-24

    申请号：US14927477

    申请日：2015-10-30

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin ,  Meng-Ting Tsai

    IPC: H01L33/62 ,  H05K1/05 ,  H05K1/02 ,  H05K3/34

    CPC classification number: H05K1/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/3436 ,  H05K2201/10106

    Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

    LIGHT-EMITTING DIODE (LED) PACKAGE
    9.
    发明申请
    LIGHT-EMITTING DIODE (LED) PACKAGE 审中-公开
    发光二极管（LED）封装

    公开(公告)号：US20160293806A1

    公开(公告)日：2016-10-06

    申请号：US15088123

    申请日：2016-04-01

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin

    IPC: H01L33/50 ,  H01L33/54 ,  F21S8/10 ,  H01L33/48

    CPC classification number: H01L33/502 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54

    Abstract: A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper surface. The LED chip is mounted on the upper surface and is electrically connected to the rectangular carrier. The encapsulant has a curved convex surface and covers the entire upper surface and the LED chip. The encapsulant is doped with a phosphor material for converting at least parts of light emitted from the LED chip. The encapsulant doped with the phosphor material is visually neon orange when the LED chip does not emit the light.

    Abstract translation: 提供了包括矩形载体，LED芯片和密封剂的发光二极管（LED）封装。 矩形载体具有上表面。 LED芯片安装在上表面上并与矩形载体电连接。 密封剂具有弯曲的凸面并且覆盖整个上表面和LED芯片。 该密封剂掺杂有用于转换从LED芯片发射的光的至少一部分的荧光体材料。 当LED芯片不发光时，掺杂有磷光体材料的密封剂视觉上呈霓虹橙色。

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