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公开(公告)号：US09496461B2
公开(公告)日：2016-11-15
申请号：US14686790
申请日：2015-04-15
Applicant: Genesis Photonics Inc.
Inventor： Yu-Feng Lin , Po-Tsun Kuo , Meng-Ting Tsai
CPC classification number: H01L33/486 , H01L33/502 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/16 , H01L2924/181 , H01L2924/00012
Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.
Abstract translation: 提供了包括载体基板，倒装芯片LED和模塑料的LED封装结构。 载体基板包括主体和嵌入主体中的图案化导电层。 主体由聚合物材料组成。 主体具有空腔，并且空腔的底表面与图案化导电层的上表面对齐。 橡胶状态下的主体与图案化的导电层之间的热膨胀系数的差小于30ppm /℃。倒装芯片LED设置在空腔内并与图案化的导电层电连接。 模塑料置于空腔内并封装倒装芯片LED。 模制化合物的顶表面和腔的底表面之间的垂直距离小于或等于腔的深度。
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2.发明申请CIRCUIT BOARD FOR DRIVING FLIP-CHIP LIGHT EMITTING CHIP AND LIGHT EMITTING MODULE COMPRISING THE SAME 审中-公开用于驱动闪烁芯片发光芯片的电路板和包含其的发光模块公开(公告)号：US20160123565A1
公开(公告)日：2016-05-05
申请号：US14927456
申请日：2015-10-29
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Meng-Ting Tsai , Yu-Feng Lin
CPC classification number: H05K3/0011 , F21K9/90 , F21Y2115/10 , H05K1/0203 , H05K1/05 , H05K3/3452 , H05K2201/09745 , H05K2201/10106 , H05K2201/10674 , H05K2201/2054
Abstract: A circuit board for driving a flip-chip light emitting chip is disclosed. The circuit board includes a metal substrate having a first surface and a second surface, the first surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area for providing a first voltage; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area for providing a second voltage; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the first surface; wherein the heat conduction area is exposed from the solder resist layer.
Abstract translation: 公开了一种用于驱动倒装芯片发光芯片的电路板。 电路板包括具有第一表面和第二表面的金属基底，第一表面包括第一电极区域，第二电极区域和导热区域; 形成在所述第一电极区上用于提供第一电压的第一金属电极; 形成在所述第一金属电极和所述金属基板之间的第一绝缘层; 形成在所述第二电极区上用于提供第二电压的第二金属电极; 形成在所述第二金属电极和所述金属基板之间的第二绝缘层; 以及覆盖所述第一表面的阻焊层; 其中所述热传导区域从所述阻焊层暴露。
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公开(公告)号：US20160123568A1
公开(公告)日：2016-05-05
申请号：US14927477
申请日：2015-10-30
Applicant: Genesis Photonics Inc.
Inventor： Hao-Chung Lee , Yu-Feng Lin , Meng-Ting Tsai
CPC classification number: H05K1/05 , H01L33/62 , H01L2224/16225 , H01L2924/15311 , H05K1/0203 , H05K3/3436 , H05K2201/10106
Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.
Abstract translation: 发光器件包括光源，光源载体和电路板。 电路板被配置为经由光源载体向光源提供电力。 电路板包括具有上表面的金属基板，上表面包括第一电极区域，第二电极区域和导热区域; 形成在所述第一电极区域上的第一金属电极; 形成在所述第一金属电极和所述金属基板之间的第一绝缘层; 形成在所述第二电极区上的第二金属电极; 形成在所述第二金属电极和所述金属基板之间的第二绝缘层; 以及覆盖金属基板的上表面的阻焊层; 其中所述导热区域从所述阻焊层露出，并且所述导热区域连接到所述光源载体。
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公开(公告)号：US10064272B2
公开(公告)日：2018-08-28
申请号：US15790168
申请日：2017-10-23
Applicant: GENESIS PHOTONICS INC.
Inventor： Hao-Chung Lee , Yu-Feng Lin , Meng-Ting Tsai
CPC classification number: H05K1/05 , H01L33/62 , H01L2224/16225 , H01L2924/15311 , H05K1/0203 , H05K3/3436 , H05K2201/10106
Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.
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公开(公告)号：US09801274B2
公开(公告)日：2017-10-24
申请号：US14927477
申请日：2015-10-30
Applicant: Genesis Photonics Inc.
Inventor： Hao-Chung Lee , Yu-Feng Lin , Meng-Ting Tsai
CPC classification number: H05K1/05 , H01L33/62 , H01L2224/16225 , H01L2924/15311 , H05K1/0203 , H05K3/3436 , H05K2201/10106
Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.
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Patent Agency Ranking
公开(公告)号：US20170062664A1
公开(公告)日：2017-03-02
申请号：US15351380
申请日：2016-11-14
Applicant: Genesis Photonics Inc.
Inventor： Yu-Feng Lin , Po-Tsun Kuo , Meng-Ting Tsai
CPC classification number: H01L33/486 , H01L33/502 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/16 , H01L2924/181 , H01L2924/00012
Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.
Abstract translation: 提供了包括载体基板，倒装芯片LED和模塑料的LED封装结构。 载体基板包括主体和嵌入主体中的图案化导电层。 主体由聚合物材料组成。 主体具有空腔，并且空腔的底表面与图案化导电层的上表面对齐。 橡胶状态下的主体与图案化的导电层之间的热膨胀系数的差小于30ppm /℃。倒装芯片LED设置在空腔内并与图案化的导电层电连接。 模塑料置于空腔内并封装倒装芯片LED。 模制化合物的顶表面和腔的底表面之间的垂直距离小于或等于腔的深度。
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公开(公告)号：US20160118561A1
公开(公告)日：2016-04-28
申请号：US14733957
申请日：2015-06-08
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Meng-Ting Tsai , Yu-Feng Lin
IPC: H01L33/62 , H01L25/075 , H01L33/60
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to a circuit structure of a flip-chip light emitting diode. It is provided for assembling of the flip-chip light emitting diode. Each flip-chip light emitting diode has at least two electrodes. The circuit structure defines a light emitting surface on a surface of a substrate, and the light emitting surface is provided with a plurality of reflective and conductive surfaces. The reflective and conductive surface is used for assembling of the electrodes of the flip-chip light emitting diode. At least one flip-chip light emitting diode is connected in series, parallel or series-parallel on the light emitting surface, wherein the total area of the reflective and conductive surface accounts for 80% to 99% of the area of the light emitting surface. Accordingly, the circuit structure of the flip-chip light emitting diode can efficiently improve the luminous efficiency of flip-chip light emitting diode device by adding a proportion of the area of the reflective conduction surfaces on the substrate of the flip-chip light emitting diode.
Abstract translation: 本发明涉及倒装芯片发光二极管的电路结构。 提供用于组装倒装芯片发光二极管。 每个倒装芯片发光二极管具有至少两个电极。 电路结构限定了衬底表面上的发光表面，并且发光表面设置有多个反射和导电表面。 反射和导电表面用于组装倒装芯片发光二极管的电极。 至少一个倒装芯片发光二极管在发光表面上串联，并联或串联平行连接，其中反射和导电表面的总面积占发光表面面积的80％至99％ 。 因此，倒装芯片发光二极管的电路结构可以通过在倒装芯片发光二极管的基板上添加反射导电表面积的一部分来有效地提高倒装芯片发光二极管器件的发光效率 。
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公开(公告)号：US20150311190A1
公开(公告)日：2015-10-29
申请号：US14697641
申请日：2015-04-28
Applicant: Genesis Photonics Inc.
Inventor： Meng-Ting Tsai , Hao-Chung Lee , Yu-Feng Lin
CPC classification number: H01L27/0248 , H01L25/167 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16245
Abstract: A light emitting diode (LED) package structure including a carrier substrate, a LED and an electrostatic protection device is provided. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes. The reflective member has a cavity, and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes. The LED is disposed inside the cavity and bridges the leadframes. The electrostatic protection device is disposed inside the cavity and bridges the leadframes. The LED is connected in anti-parallel to the electrostatic protection device.
Abstract translation: 提供了包括载体基板，LED和静电保护装置的发光二极管（LED）封装结构。 载体基板包括彼此分离的两个引线框和反射构件。 反射构件封装引线框并且暴露每个引线框的载体表面。 反射构件具有空腔，并且空腔的底表面与每个引线框的载体表面对准。 LED设置在腔内并桥接引线框架。 静电保护装置设置在腔内并桥接引线框架。 LED与静电保护装置反并联连接。
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公开(公告)号：US20180049319A1
公开(公告)日：2018-02-15
申请号：US15790168
申请日：2017-10-23
Applicant: GENESIS PHOTONICS INC.
Inventor： Hao-Chung Lee , Yu-Feng Lin , Meng-Ting Tsai
IPC: H05K1/05
CPC classification number: H05K1/05 , H01L33/62 , H01L2224/16225 , H01L2924/15311 , H05K1/0203 , H05K3/3436 , H05K2201/10106
Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.
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公开(公告)号：US20150325758A1
公开(公告)日：2015-11-12
申请号：US14686790
申请日：2015-04-15
Applicant: Genesis Photonics Inc.
Inventor： Yu-Feng Lin , Po-Tsun Kuo , Meng-Ting Tsai
CPC classification number: H01L33/486 , H01L33/502 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/16 , H01L2924/181 , H01L2924/00012
Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.
Abstract translation: 提供了包括载体基板，倒装芯片LED和模塑料的LED封装结构。 载体基板包括主体和嵌入主体中的图案化导电层。 主体由聚合物材料组成。 主体具有空腔，并且空腔的底表面与图案化导电层的上表面对齐。 橡胶状态下的主体与图案化的导电层之间的热膨胀系数的差小于30ppm /℃。倒装芯片LED设置在空腔内并与图案化的导电层电连接。 模塑料置于空腔内并封装倒装芯片LED。 模制化合物的顶表面和腔的底表面之间的垂直距离小于或等于腔的深度。
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