公开(公告)号：US20150287893A1

公开(公告)日：2015-10-08

申请号：US14676821

申请日：2015-04-02

Applicant: Genesis Photonics Inc.

Inventor： Kuan-Chieh Huang ,  Chun-Ming Tseng ,  Wen-Jie Lu ,  Tsung-Tse Wu ,  Wei-Ling Su ,  Kuan-Yung Liao ,  Gwo-Jiun Sheu

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/507 ,  H01L33/54 ,  H01L2933/0091

Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.

Abstract translation: 用于封装光电装置的封装材料包括第一模制部分和第二模塑部分。 第一模制部分设置在光电装置上。 第一成型部分包括第一模塑料和多种纳米级金属氧化物颗粒，其中纳米级金属氧化物颗粒掺杂在第一模塑料中。 第二模制部分设置在第一模制部分上并远离光电装置。 第二成型部分包括第二模塑料和多个亚微米级金属氧化物颗粒，其中亚微米级金属氧化物颗粒掺杂在第二模塑料中。 第一成型部分的整体折射率大于第二成型部分的整体折射率。