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    PACKAGE MATERIAL FOR PACKAGING PHOTOELECTRIC DEVICE AND PACKAGE
    4.
    发明申请
    PACKAGE MATERIAL FOR PACKAGING PHOTOELECTRIC DEVICE AND PACKAGE 审中-公开
    用于包装光电装置和包装的包装材料

    公开(公告)号：US20150287893A1

    公开(公告)日：2015-10-08

    申请号：US14676821

    申请日：2015-04-02

    Applicant: Genesis Photonics Inc.

    Inventor： Kuan-Chieh Huang ,  Chun-Ming Tseng ,  Wen-Jie Lu ,  Tsung-Tse Wu ,  Wei-Ling Su ,  Kuan-Yung Liao ,  Gwo-Jiun Sheu

    IPC: H01L33/58 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56

    CPC classification number: H01L33/507 ,  H01L33/54 ,  H01L2933/0091

    Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.

    Abstract translation: 用于封装光电装置的封装材料包括第一模制部分和第二模塑部分。 第一模制部分设置在光电装置上。 第一成型部分包括第一模塑料和多种纳米级金属氧化物颗粒，其中纳米级金属氧化物颗粒掺杂在第一模塑料中。 第二模制部分设置在第一模制部分上并远离光电装置。 第二成型部分包括第二模塑料和多个亚微米级金属氧化物颗粒，其中亚微米级金属氧化物颗粒掺杂在第二模塑料中。 第一成型部分的整体折射率大于第二成型部分的整体折射率。

    Light-emitting device and manufacturing method thereof
    5.
    发明授权
    Light-emitting device and manufacturing method thereof 有权

    公开(公告)号：US10804444B2

    公开(公告)日：2020-10-13

    申请号：US16595414

    申请日：2019-10-07

    Applicant: Genesis Photonics Inc.

    Inventor： Cheng-Wei Hung ,  Long-Chi Tu ,  Jui-Fu Chang ,  Chun-Ming Tseng ,  Yun-Chu Chen

    IPC: H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L33/54

    Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE

    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20200035875A1

    公开(公告)日：2020-01-30

    申请号：US16595414

    申请日：2019-10-07

    Applicant: Genesis Photonics Inc.

    Inventor： Cheng-Wei Hung ,  Long-Chi Tu ,  Jui-Fu Chang ,  Chun-Ming Tseng ,  Yun-Chu Chen

    IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/56 ,  H01L33/62

    Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE

    Light emitting device and manufacturing method thereof
    7.
    发明授权
    Light emitting device and manufacturing method thereof 有权

    公开(公告)号：US10439111B2

    公开(公告)日：2019-10-08

    申请号：US15788757

    申请日：2017-10-19

    Applicant: Genesis Photonics Inc.

    Inventor： Cheng-Wei Hung ,  Long-Chi Tu ,  Jui-Fu Chang ,  Chun-Ming Tseng ,  Yun-Chu Chen

    IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56 ,  H01L33/54

    Abstract: A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE

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