公开(公告)号：US20140353018A1

公开(公告)日：2014-12-04

申请号：US14287242

申请日：2014-05-27

Applicant: HITACHI, LTD.

Inventor： Akira SOEDA ,  Chiko YORITA ,  Shinichirou TOOYA ,  Takayuki ONO ,  Mitsuru TAKAHIRA ,  Yuuichi SEKINO ,  Akira GOTO ,  Yoshimasa TASHIRO ,  Hiroyuki DOI ,  Tsutomu SAKAMOTO

IPC: H05K3/40 ,  H05K1/09 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/4614 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K3/306 ,  H05K2201/044 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2201/10234 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49165

Abstract: An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.

Abstract translation: 在具有穿刺TH的第一多层基板的接合表面上形成连接到需要导电的TH垫的电极，以在电极上形成焊料凸块。 连接到TH焊盘的电极形成在与要形成在第一多层基板上的电极相对的位置处具有穿刺TH的待接合的第二多层基板的接合表面上，以在电极上形成焊料凸块。 通过将作为树脂材料的粘合剂施加到作为固化树脂的芯材的两个表面的树脂材料上，并且在与TH和焊料凸块相对应的位置处分别具有孔，形成三层片。 然后将第一和第二多层基板层压，其中具有彼此面对的接合表面，同时具有定位并插入其中的三层片材，并进行批量热压接。

公开(公告)号：US20130133936A1

公开(公告)日：2013-05-30

申请号：US13687734

申请日：2012-11-28

Applicant: Hitachi, Ltd.

Inventor： Chiko YORITA ,  Takashi KATANO ,  Takayuki ONO ,  Yoshimasa TASHIRO ,  Yuichi SEKINO ,  Masami ONO ,  Tsutomu SAKAMOTO ,  Hiroyuki DOI ,  Shinichi FUJIWARA

IPC: H05K1/09 ,  B23K31/02

CPC classification number: H05K1/09 ,  B23K31/02 ,  H05K3/325 ,  H05K3/3478 ,  H05K3/4623 ,  H05K2201/0218 ,  H05K2201/044 ,  H05K2201/1059 ,  H05K2203/061

Abstract: Provided is an integral thermal compression bonded board technology which is high in reliability and low in cost. In a process of bonding printed boards to each other, electrodes are connected with each other by solder connection using a Cu core solder plated ball and the boards are bonded by a three-layer bonding material constituted by a bonding material layer, a ball maintaining core layer, and the bonding layer, and solder of the Cu core solder plated ball inserted into holes of three layers is formed by integral thermal compression. They are connected with each other by flux or welcoming solder.

Abstract translation: 提供了一种可靠性高，成本低的集成热压接板技术。 在将印刷电路板彼此接合的过程中，电极通过使用Cu芯焊料球的焊料连接而彼此连接，并且通过由接合材料层，保压芯构成的三层接合材料来接合电路板 层和结合层，并且通过整体热压缩形成插入三层孔的Cu芯焊料球的焊料。 它们通过焊剂或热熔焊料彼此连接。