公开(公告)号：US20130029458A1

公开(公告)日：2013-01-31

申请号：US13627312

申请日：2012-09-26

Applicant: HYNIX SEMICONDUCTOR INC.

Inventor： Woong Sun LEE

IPC: H01L21/60

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/247 ,  H05K3/3457 ,  H05K2201/035 ,  H05K2201/09436 ,  H01L2924/00

Abstract: A substrate for a semiconductor package includes a ball land disposed on one surface of an insulating layer. A solder resist is applied to the surface of insulating layer while leaving the ball land exposed. A coating film is applied on the exposed surface of the ball land. The coating film includes a high molecular compound having metal particles. In the substrate having the ball land with the coating film formed thereon, it is not necessary to subject the substrate to a UBM formation process.

Abstract translation: 用于半导体封装的衬底包括设置在绝缘层的一个表面上的球形区域。 在绝缘层的表面上施加阻焊剂，同时露出球场。 将涂膜施加在球面的暴露表面上。 涂膜包括具有金属颗粒的高分子化合物。 在其上形成有涂膜的球面的基板中，不需要使基板进行UBM形成工艺。