中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.013 seconds)

    Fixtures for Chemical Vapor Deposition Gradient Coatings
    1.
    发明公开
    Fixtures for Chemical Vapor Deposition Gradient Coatings 审中-公开

    公开(公告)号：US20240093359A1

    公开(公告)日：2024-03-21

    申请号：US18468680

    申请日：2023-09-15

    Applicant: HZO, Inc.

    Inventor： Sean Clancy ,  James Tosh

    IPC: C23C16/04

    CPC classification number: C23C16/04

    Abstract: A fixture for depositing a gradient coating includes a single opening on a front side of the fixture, such that the fixture is configured to house a substrate during deposition of a coating and configured to surround the substrate on all sides of the substrate except for a single front side of the substrate, and wherein the fixture is configured to restrict egress of coating material to the substrate from all directions except through the single opening. The fixture includes a cavity such that the fixture is configured to leave an air gap between a lid surface of the fixture and the major top side of the substrate, and a cavity depth, measured from the front side of the fixture to a back of the cavity, is greater than a gap opening distance, measured from the lid surface at the opening to the major top side of the substrate.

    Functional Termination of Parylene in Vacuum
    2.
    发明申请
    Functional Termination of Parylene in Vacuum 有权

    公开(公告)号：US20210138503A1

    公开(公告)日：2021-05-13

    申请号：US17098279

    申请日：2020-11-13

    Applicant: HZO, Inc.

    Inventor： Robert Askin ,  Sean Clancy

    IPC: B05D1/00 ,  B05D7/00

    Abstract: A method includes adding a coating on a substrate, wherein the coating is a protective coating for the substrate and adding a chemistry to an outer portion or surface of the coating on the substrate. The chemistry is configured to better facilitate a creation of a chemical bond between the coating and a second layer to be applied to the coating.

    INCREASED DEPOSITION EFFICIENCY VIA DUAL REACTOR SYSTEM
    6.
    发明申请
    INCREASED DEPOSITION EFFICIENCY VIA DUAL REACTOR SYSTEM 有权

    公开(公告)号：US20210332261A1

    公开(公告)日：2021-10-28

    申请号：US17239516

    申请日：2021-04-23

    Applicant: HZO, Inc.

    Inventor： Robert Eugene Askin, III ,  Sean Clancy

    IPC: C09D165/02

    Abstract: A method for depositing Parylene onto a substrate includes operating a first pyrolysis chamber at a first set of parameters to cause cracking of dimers into monomers at the first set of parameters and operating a second pyrolysis chamber at a second set of parameters to cause cracking of dimers into monomers at the second set of parameters. The method includes mixing the monomers at the first set of parameters with monomers at the second set of parameters together and polymerizing the mixture as a protective coating.

    Increased deposition efficiency via dual reactor system
    7.
    发明授权
    Increased deposition efficiency via dual reactor system 有权

    公开(公告)号：US12209199B2

    公开(公告)日：2025-01-28

    申请号：US17239516

    申请日：2021-04-23

    Applicant: HZO, Inc.

    Inventor： Robert Eugene Askin, III ,  Sean Clancy

    IPC: C09D165/02 ,  C09D165/04 ,  C23C14/12 ,  C23C16/448 ,  C23C16/455

    Abstract: A method for depositing Parylene onto a substrate includes operating a first pyrolysis chamber at a first set of parameters to cause cracking of dimers into monomers at the first set of parameters and operating a second pyrolysis chamber at a second set of parameters to cause cracking of dimers into monomers at the second set of parameters. The method includes mixing the monomers at the first set of parameters with monomers at the second set of parameters together and polymerizing the mixture as a protective coating.

    Plasma Ashing for Coated Devices
    8.
    发明申请
    Plasma Ashing for Coated Devices 有权

    公开(公告)号：US20210127497A1

    公开(公告)日：2021-04-29

    申请号：US17084618

    申请日：2020-10-29

    Applicant: HZO, Inc.

    Inventor： Sean Clancy ,  Benjamin Lawrence ,  Alexander Niebroski

    IPC: H05K3/00 ,  H05K3/22 ,  H01J37/32 ,  G03F7/038 ,  G03F7/039

    Abstract: A plasma ashing system includes a plasma generator configured to generate a plasma from a gas source. The system further includes a plasma reaction chamber configured to house a substrate comprising a Parylene coating, wherein the plasma reaction chamber is configured to expose surfaces of the Parylene coating on the substrate to the plasma, wherein the plasma is configured to remove portions of the Parylene coating on the substrate.

Patent Agency Ranking