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公开(公告)号：US07242083B2
公开(公告)日：2007-07-10
申请号：US11109734
申请日：2005-04-20
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
CPC classification number: H05K3/103 , H05K3/0052 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10287
Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member formed of a plurality of insulative member layers and filled up the open space, and a set of electrical elements, which includes a plurality of plated through holes cut through the insulative member layers, first lead wires embedded in the insulative member to electrically connect the plated through holes to one another, and second lead wires that connect the plated through holes to a respective adjacent pin.
Abstract translation: 包装基板由包装单元阵列形成。 每个包装单元具有载置芯片的芯片垫片，围绕芯片焊盘布置的多个引脚，彼此间隔开并且芯片焊盘由开放空间布置，绝缘构件由多个绝缘构件层形成并填充开放 空间和一组电气元件，其包括穿过绝缘构件层的多个电镀通孔，嵌入在绝缘构件中的第一引线以将电镀通孔彼此电连接;以及第二引线，其将 电镀通孔到相应的相邻引脚。
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公开(公告)号：US20090194991A1
公开(公告)日：2009-08-06
申请号：US12068267
申请日：2008-02-05
Applicant: Cheng-En Yang , Hsin-Chen Yang
Inventor： Cheng-En Yang , Hsin-Chen Yang
IPC: F16L21/00
CPC classification number: E04B1/585 , A47B47/0008 , A47B47/005 , E04B2001/5856 , F16B12/40
Abstract: This invention provides an iron pipe furniture assembly structure principally using the pipe connector as the connection construction component of the supporting shaft and the pipe element, and utilizing the elongated round-shaped fastening shaft of the pipe connector at the insertion center for connection with the pipe element and coupled with the diamond round-shaped insertion hole of the insertion cork of the pipe element end portion and the long diameter direction slot of the insertion hole to give sufficient room for movement, and further supplemented with the indent groove on the lateral side near the end portion of the pipe element for the tool to operate and spiral turn the pipe element, thereby the assembly operation of the pipe element and the pipe connector can be easily and speedily accomplished with certain simple insertions and spiral turning operations.
Abstract translation: 本发明提供了一种铁管家具总成结构，主要使用管连接器作为支撑轴和管件的连接结构部件，并且在插入中心处利用管连接器的细长圆形紧固轴与管道连接 并与管元件端部的插入软木的金刚石圆形插入孔和插入孔的长径方向槽相配合，以提供足够的运动空间，并进一步补充在侧面附近的凹槽 用于工具的管件的端部部分操作并螺旋转动管件，从而可以通过某些简单的插入和螺旋转动操作来容易且快速地实现管件和管连接器的组装操作。
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公开(公告)号：US07154169B2
公开(公告)日：2006-12-26
申请号：US11109823
申请日：2005-04-20
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: H01L23/02
CPC classification number: H01L23/49811 , H01L23/49861 , H01L2924/0002 , H01L2924/00
Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.
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公开(公告)号：US20060223240A1
公开(公告)日：2006-10-05
申请号：US11109785
申请日：2005-04-20
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: H01L21/56
CPC classification number: H01L21/4846 , H01L21/4803 , H01L21/565 , H01L23/49861 , H01L2924/0002 , H01L2924/00
Abstract: A method of making an IC substrate includes the steps of: a) preparing a substrate having a front side and a back side and half-etching the substrate to form a filling space in the front side of the substrate subject to a predetermined depth and area, b) putting the substrate thus obtained from step a) in a cavity of a mold and employing a polymer filling and mold pressing procedure to fill up the filling space with an insulative polymer, and c) removing the substrate from the mold and half-etching the back side of the substrate body so as to obtain an IC substrate.
Abstract translation: 制造IC基板的方法包括以下步骤：a）制备具有正面和背面的基板，并且半基板蚀刻以在基板的前侧形成填充空间，该填充空间经受预定的深度和面积 b）将由步骤a）获得的基材放入模具的空腔中，并使用聚合物填充和模压步骤，用绝缘聚合物填充填充空间，以及c）从模具中取出基材， 蚀刻基板主体的背面以获得IC基板。
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公开(公告)号：US20060221586A1
公开(公告)日：2006-10-05
申请号：US11117511
申请日：2005-04-29
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: H05K1/18
CPC classification number: H01L23/49861 , H01L23/49548 , H01L2924/0002 , H05K1/111 , H05K3/06 , H05K3/3442 , H05K2201/0376 , H05K2201/09745 , H05K2201/09881 , H05K2201/10636 , H05K2203/0369 , Y02P70/611 , Y02P70/613 , H01L2924/00
Abstract: A packaging substrate includes an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space, passive components each connected between two pins, a bonding adhesive applied to the pins to which the passive components is connected to affix the connection between the passive components and the respective pins, and a plurality of overflow-preventive grooves respectively provided around the bonding adhesive at each of the pins to which the passive components are connected to prevent overflow of the bonding adhesive.
Abstract translation: 包装衬底包括一组包装单元。 每个包装单元具有载置芯片的芯片垫片，布置在芯片焊盘周围的多个引脚，彼此间隔开并且芯片焊盘由开放空间，填充开放空间的绝缘构件，各自连接在两个引脚之间的无源元件 施加到被连接无源部件的引脚上的粘合粘合剂以固定无源部件和相应引脚之间的连接，以及分别设置在每个引脚周围的粘合粘合剂周围的多个防溢流槽， 被动部件被连接以防止粘结粘合剂溢出。
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Patent Agency Ranking
公开(公告)号：US07044312B2
公开(公告)日：2006-05-16
申请号：US10461375
申请日：2003-06-16
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: A47B47/00
CPC classification number: A47C19/021 , A47B57/40 , A47B57/402 , A47B96/021 , A47C19/207
Abstract: A multi-purpose tubular frame structure that is assembled by an interlocking conjoinment and, furthermore, provides for height adjustment. A plurality of retaining holes are formed in the corner posts of the invention herein and each retaining hole is a semi-trapezoidal opening with the sides at the lower half gradually angled inward such that cleat blocks disposed on a horizontal tube can be positionally engaged therein.
Abstract translation: 一种多用途管状框架结构，其通过互锁结合组装，并且还提供高度调节。 在本发明的角柱中形成多个保持孔，并且每个保持孔是半梯形开口，其下半部的侧边逐渐向内倾斜，使得设置在水平管上的防滑板块可以位于其中。
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公开(公告)号：US20060249819A1
公开(公告)日：2006-11-09
申请号：US11144639
申请日：2005-06-06
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: H01L23/495
CPC classification number: H01L23/66 , H01L23/49548 , H01L2924/0002 , H01L2924/19105 , H01L2924/3011 , H01L2924/00
Abstract: A lead frame has contacting pins of different thickness arranged around a die pad and spaced from one another and the die pad to fit the demands of the designed integrated circuit, for enabling the fabricated integrated circuit to have the desired optimum electric characteristics.
Abstract translation: 引线框架具有布置在管芯焊盘周围并且彼此间隔开的不同厚度的接触引脚，以及管芯焊盘以适应所设计的集成电路的要求，以使所制造的集成电路具有期望的最佳电气特性。
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公开(公告)号：US20060220219A1
公开(公告)日：2006-10-05
申请号：US11109734
申请日：2005-04-20
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
IPC: H01L23/04
CPC classification number: H05K3/103 , H05K3/0052 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/10287
Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member formed of a plurality of insulative member layers and filled up the open space, and a set of electrical elements, which includes a plurality of plated through holes cut through the insulative member layers, first lead wires embedded in the insulative member to electrically connect the plated through holes to one another, and second lead wires that connect the plated through holes to a respective adjacent pin.
Abstract translation: 包装基板由包装单元阵列形成。 每个包装单元具有载置芯片的芯片垫片，围绕芯片焊盘布置的多个引脚，彼此间隔开并且芯片焊盘由开放空间布置，绝缘构件由多个绝缘构件层形成并填充开放 空间和一组电气元件，其包括穿过绝缘构件层的多个电镀通孔，嵌入在绝缘构件中的第一引线以将电镀通孔彼此电连接;以及第二引线，其将 电镀通孔到相应的相邻引脚。
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公开(公告)号：US20060220200A1
公开(公告)日：2006-10-05
申请号：US11109823
申请日：2005-04-20
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
CPC classification number: H01L23/49811 , H01L23/49861 , H01L2924/0002 , H01L2924/00
Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.
Abstract translation: 包装基板由包装单元阵列形成。 每个包装单元包括其上承载有芯片的芯片焊盘，布置在芯片焊盘周围的多个引脚并且彼此间隔开并且芯片焊盘由开放空间布置，绝缘构件填充开放空间并且形成有引脚 并且芯片焊盘是平台，以及位于绝缘构件处的引线，用于直接或通过无源部件连接引脚。
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公开(公告)号：US6044988A
公开(公告)日：2000-04-04
申请号：US305081
申请日：1999-05-04
Applicant: Hsin-Chen Yang
Inventor： Hsin-Chen Yang
CPC classification number: A47B57/265
Abstract: A modular rack comprises a plurality of upright support rods and shelves which are supported on various levels of the upright support rods in conjunction with a plurality of locating pieces, sleeves, and retaining pieces. The sleeves are fastened with the upright support rods in conjunction with the locating pieces and are provided with a retaining seat. The retaining pieces are fastened with four comers of the shelves. The shelves are releasably retained at various levels of the upright support rods such that the retaining pieces of the shelves are releasably retained by the retaining seats of the sleeves.
Abstract translation: 模块化支架包括多个直立的支撑杆和搁架，它们与多个定位件，套筒和保持件一起被支撑在各个级别的直立支撑杆上。 袖子与定位件一起用立式支撑杆紧固，并设有保持座。 固定件用四个货架的角落固定。 搁架可释放地保持在竖直支撑杆的各种水平处，使得搁架的保持件可释放地由套筒的保持座保持。
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