公开(公告)号：US20130182395A1

公开(公告)日：2013-07-18

申请号：US13623731

申请日：2012-09-20

Applicant: Huawei Device Co., Ltd.

Inventor： Haixing Ding ,  Guifu Xie

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0268 ,  H05K1/0295 ,  H05K1/113 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10477 ,  H05K2203/162

Abstract: Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.

Abstract translation: 本发明的实施例提供一种集成模块。 集成模块包括印刷电路板PCB和模块化设备，其中模块化设备安装在PCB上; 一组前销焊盘设置在PCB的前表面的四个边缘处，并且前引脚焊盘位于模块化设备的安装位置周围; 并且一组底部销焊盘设置在PCB的底表面的四个边缘处。 配置前销垫的位置与设置底部销垫的位置对称; 并且前引脚焊盘和底部引脚焊盘的网络属性相同。