公开(公告)号：US20170006743A1

公开(公告)日：2017-01-05

申请号：US15107373

申请日：2015-03-04

Applicant: Huawei Device Co., Ltd.

Inventor： Fuqiang Ma ,  Haixing Ding

IPC: H05K13/04

CPC classification number: H05K13/0469 ,  H05K3/30 ,  H05K3/321 ,  H05K5/064 ,  H05K9/0028 ,  H05K2201/10371

Abstract: An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.

Abstract translation: 辅助粘合剂分配装置通过PCB上方的屏蔽盖的侧表面上的开口连接到印刷电路板（PCB），辅助粘合剂分配装置包括导流槽，连接到印刷电路板 导流槽的端部，以及连接导流槽和PCB的固定部。 辅助粘合剂分配装置通过PCB上方的屏蔽盖的侧表面上的开口连接到PCB。 通过辅助粘合剂分配装置，在安装屏蔽盖之后仍然可以执行粘合剂分配操作，从而可以在第二次回流焊接处理之后执行粘合剂分配操作。

公开(公告)号：US20130182395A1

公开(公告)日：2013-07-18

申请号：US13623731

申请日：2012-09-20

Applicant: Huawei Device Co., Ltd.

Inventor： Haixing Ding ,  Guifu Xie

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0268 ,  H05K1/0295 ,  H05K1/113 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10477 ,  H05K2203/162

Abstract: Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.

Abstract translation: 本发明的实施例提供一种集成模块。 集成模块包括印刷电路板PCB和模块化设备，其中模块化设备安装在PCB上; 一组前销焊盘设置在PCB的前表面的四个边缘处，并且前引脚焊盘位于模块化设备的安装位置周围; 并且一组底部销焊盘设置在PCB的底表面的四个边缘处。 配置前销垫的位置与设置底部销垫的位置对称; 并且前引脚焊盘和底部引脚焊盘的网络属性相同。