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    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180110164A1

    公开(公告)日：2018-04-19

    申请号：US15783330

    申请日：2017-10-13

    Applicant: IBIDEN CO., LTD

    Inventor： Toshiki FURUTANI ,  Takema Adachi ,  Hidetoshi Noguchi ,  Shota Tachibana

    IPC: H05K9/00 ,  H05K13/00

    CPC classification number: H05K9/0086 ,  H05K9/003 ,  H05K9/0084 ,  H05K9/0088 ,  H05K13/0084 ,  H05K2201/0338 ,  H05K2201/0707

    Abstract: A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

    PRINTED WIRING BOARD
    4.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20160174372A1

    公开(公告)日：2016-06-16

    申请号：US14971309

    申请日：2015-12-16

    Applicant: IBIDEN CO., LTD.

    Inventor： Yasushi INAGAKI ,  Toshiki FURUTANI

    IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/113 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/18161 ,  H05K1/111 ,  H05K3/4682 ,  H05K2201/10674 ,  Y02P70/611

    Abstract: A printed wiring board includes a first insulating layer having concave portions on first surface of the first insulating layer, a first conductor layer including first circuits formed in the concave portions, a second conductor layer including second circuits on second surface of the first insulating layer, a first via conductor connecting the first and second conductor layers, and a second insulating layer formed on the second surface of the first insulating layer and covering the second conductor layer. Each first circuit has upper, lower and side surfaces such that the upper surface is exposed from the first insulating layer and the side and lower surfaces are not roughened surfaces, each second circuit has top, back and side surfaces such that the side and back surfaces are roughened surfaces, and a thinnest first circuit has a line width L1 smaller than a line width L2 of a thinnest second circuit.

    Abstract translation: 印刷电路板包括在第一绝缘层的第一表面上具有凹部的第一绝缘层，包括形成在凹部中的第一电路的第一导体层，在第一绝缘层的第二表面上包括第二电路的第二导体层， 连接第一和第二导体层的第一通孔导体以及形成在第一绝缘层的第二表面上并覆盖第二导体层的第二绝缘层。 每个第一电路具有上表面，下表面和侧表面，使得上表面从第一绝缘层暴露，并且侧表面和下表面不是粗糙表面，每个第二电路具有顶表面，背面和侧表面，使得侧表面和后表面 是粗糙表面，最薄的第一电路的线宽L1小于最薄的第二电路的线宽L2。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20160021758A1

    公开(公告)日：2016-01-21

    申请号：US14799860

    申请日：2015-07-15

    Applicant: IBIDEN CO., LTD.

    Inventor： Toshiki FURUTANI ,  Yasushi INAGAKI

    IPC: H05K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

    CPC classification number: H05K1/09 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/103 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0341 ,  H05K2201/094 ,  H05K2203/0384 ,  Y02P70/611

    Abstract: A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer.

    Abstract translation: 印刷布线板包括绝缘层，嵌入绝缘层的第一表面中的第一导电层，形成在绝缘层的第二表面上的第二导电层，穿过绝缘层的通孔导体，并将第一和第二 层，以及覆盖第一层并具有形成第一层的暴露结构的开口结构的阻焊层。 形成暴露结构以将电子部件连接到第一层，并且第一层在第一层上具有阻挡金属层和金属层，使得阻挡金属层在第一层的表面上并且包括金属 与形成金属层的金属不同，并且金属层位于暴露结构中的阻挡金属层的表面上并且从绝缘层的第一表面突出。

    PRINTED WIRING BOARD
    8.
    发明申请
    PRINTED WIRING BOARD 有权
    印刷线路板

    公开(公告)号：US20140014399A1

    公开(公告)日：2014-01-16

    申请号：US13754185

    申请日：2013-01-30

    Applicant: IBIDEN CO., LTD.

    Inventor： Takashi KARIYA ,  Toshiki FURUTANI ,  Takeshi FURUSAWA

    IPC: H05K1/02

    CPC classification number: H05K1/02 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2201/09136 ,  H01L2924/00

    Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 μm or greater and less than 380 μm, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

    Abstract translation: 印刷电路板分别包括芯基板，在芯的表面上的第一和第二累积结构以及分别在第一和第二结构上的第一和第二阻焊层。 芯包括绝缘衬底，衬底表面上的导电层和连接导电层的通孔导体，第一结构包括第一结构中的层间绝缘层和导电层，第二结构包括层间绝缘层和导电层 第二结构，第一和第二阻焊层的外表面之间的厚度设定在150μm以上且小于380μm的范围内，以及芯，第一和第二结构中的至少一个，以及第一和第二结构 第二阻焊层包括增强材料，其量使得该板包括量为20至35体积的材料。 ％。

    WIRING SUBSTRATE
    9.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240008176A1

    公开(公告)日：2024-01-04

    申请号：US18343781

    申请日：2023-06-29

    Applicant: IBIDEN CO., LTD.

    Inventor： Toshiki FURUTANI

    IPC: H05K1/02

    CPC classification number: H05K1/0298

    Abstract: A wiring substrate includes a core substrate, a first build-up part formed on a first surface of the substrate and including insulating layers and conductor layers, and a second build-up part formed on a second surface of the substate on the opposite side with respect to the first surface and including insulating layers and conductor layers. The first build-up part includes a first region and a second region such that a distance between adjacent conductor layers in the second region is smaller than a distance between adjacent conductor layers in the first region, the conductor layers in the second region include second wirings having the minimum wiring width and the minimum inter-wiring distance that are smaller than the minimum wiring width and the minimum inter-wiring distance of first wirings of the conductor layers in the first region and the insulating layers are continuous in the first region and second region.

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