公开(公告)号：US20130037932A1

公开(公告)日：2013-02-14

申请号：US13654489

申请日：2012-10-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Anwar A. Mohammed ,  Soon Ing Chew ,  Donald Fowlkes ,  Alexander Komposch ,  Benjamin Pain-Fong Law ,  Michael Opiz Real

IPC: H01L23/12 ,  F16L23/00 ,  B21D19/00 ,  H01L21/50

CPC classification number: B21D22/20 ,  H01L23/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2924/157 ,  H01L2924/161 ,  H01L2924/171 ,  H01L2924/3511 ,  H05K3/303 ,  H05K2201/10409 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.

Abstract translation: 半导体封装包括弯曲体和多个半导体管芯。 弯曲体包括第一和第二相对末端区域和中间中心区域。 弯曲体在中心区域具有第一拐点，在第一端部区域具有第二拐点，在第二端部区域具有第三拐点。 中心区域具有在第一拐点处具有最小极值的凸曲率，第一端区域具有在第二拐点处具有最大极值的凹曲率，并且第二端区域具有在第三拐点处具有最大极值的凹曲率 拐点。 多个半导体管芯在最大极值之间附接到弯曲体的上表面。

公开(公告)号：US08604609B2

公开(公告)日：2013-12-10

申请号：US13654489

申请日：2012-10-18

Applicant: Infineon Technologies AG

Inventor： Anwar A. Mohammed ,  Soon Ing Chew ,  Donald Fowlkes ,  Alexander Komposch ,  Benjamin Pain-Fong Law ,  Michael Opiz Real

IPC: H01L23/34

CPC classification number: B21D22/20 ,  H01L23/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2924/157 ,  H01L2924/161 ,  H01L2924/171 ,  H01L2924/3511 ,  H05K3/303 ,  H05K2201/10409 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.

Abstract translation: 半导体封装包括弯曲体和多个半导体管芯。 弯曲体包括第一和第二相对末端区域和中间中心区域。 弯曲体在中心区域具有第一拐点，在第一端部区域具有第二拐点，在第二端部区域具有第三拐点。 中心区域具有在第一拐点处具有最小极值的凸曲率，第一端区域具有在第二拐点处具有最大极值的凹曲率，并且第二端区域具有在第三拐点处具有最大极值的凹曲率 拐点。 多个半导体管芯在最大极值之间附接到弯曲体的上表面。