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公开(公告)号：US20140347773A1
公开(公告)日：2014-11-27
申请号：US14281845
申请日：2014-05-19
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Gyeong-Tae KIM , Myung Ho LEE , Jung Hun LEE , Euy Ho SHIN , Jin Hwan KIM , Song Yeon LEE
CPC classification number: H02H9/005 , H03H7/0115 , H03H2001/0085
Abstract: Provided is a circuit protection device including a plurality of sheets selectively formed with at least one coil pattern, at least one withdrawal electrode, at least one hole filled with a conductive material, and at least one capacitor electrode and at least two inductors and at least two capacitors, in which the at least one coil pattern forms one inductor and a capacitor is formed between the capacitor electrode and the coil pattern.
Abstract translation: 提供一种电路保护装置，其包括选择性地形成有至少一个线圈图案的多个片材，至少一个取出电极，填充有导电材料的至少一个孔，以及至少一个电容器电极和至少两个电感器，并且至少 两个电容器，其中至少一个线圈图案形成一个电感器，并且电容器形成在电容器电极和线圈图案之间。
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公开(公告)号：US20170133142A1
公开(公告)日：2017-05-11
申请号：US14986447
申请日：2015-12-31
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Myung Ho LEE , Song Yeon LEE , Jung Hun LEE , Hyun Mo KANG
CPC classification number: H01F17/0013 , H01F19/04 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/0093 , H02H9/04 , H03H1/0007 , H03H7/01 , H03H2001/0085
Abstract: The present disclosure includes: a laminate in which a plurality of sheets are laminated; two or more noise filters provided spaced apart by a predetermined distance from each other in the laminate and respectively provided with a plurality of coil patterns; an external electrode provided outside the laminate and connected to the two or more noise filters; and a connection electrode provided outside the laminate being spaced apart from the external electrode to connect the two or more coil patterns.
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公开(公告)号：US20160276995A1
公开(公告)日：2016-09-22
申请号：US15073622
申请日：2016-03-17
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Gyeong Tae KIM , Myung Ho LEE , Tae Geun SEO , Min Soo LEE , Song Yeon LEE
CPC classification number: H03H1/00 , H01F17/0013 , H01F27/2804 , H01F2017/002 , H01F2017/0026 , H01F2027/2809 , H01G4/005 , H01G4/232 , H01G4/30 , H01G4/40 , H03H7/0115 , H03H2001/0085
Abstract: Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.
Abstract translation: 提供了一种层叠芯片装置，其包括：第一层压体，其中形成在多个片材上的多个导体图案通过形成为穿透至少一个片材的通孔彼此连接;以及第二层压体，其设置在第一层压体上方或下方 并且具有形成在多个片材上的多个内部电极图案，并且内部电极图案在与通孔对应的区域的至少一部分中具有非导电区域。
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公开(公告)号：US20150280682A1
公开(公告)日：2015-10-01
申请号：US14672089
申请日：2015-03-27
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Myung Ho LEE , Jung Hun LEE , Byong Moon NAM , Hyun Mo KANG , Song Yeon LEE , Jin Hwan KIM
CPC classification number: H03H7/17 , H01F17/0013 , H01F27/24 , H01F27/2804 , H05F3/04
Abstract: A circuit protection device includes a plurality of sheets stacked in a vertical direction, each of which may include at least two conductive patterns formed separately from each other in a horizontal direction, and at least two common mode noise filters disposed in the horizontal direction, each of which includes at least two conductive patterns connected in the vertical direction.
Abstract translation: 电路保护装置包括沿垂直方向堆叠的多个片材，每个片材可以包括在水平方向上彼此分开形成的至少两个导电图案，以及至少两个沿水平方向布置的共模噪声滤波器 其中包括沿垂直方向连接的至少两个导电图案。
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