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公开(公告)号:US20180027684A1
公开(公告)日:2018-01-25
申请号:US15394321
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: STEVEN C. MILLER , MICHAEL CROCKER , AARON GORIUS , PAUL DORMITZER
IPC: H05K7/14
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F17/30949 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y10S901/01
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The dual-mode optical network interface circuitry can have a bandwidth equal to or greater than the storage devices.
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公开(公告)号:US20180027685A1
公开(公告)日:2018-01-25
申请号:US15394392
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: STEVEN C. MILLER , MICHAEL CROCKER , AARON GORIUS , PAUL DORMITZER
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F17/30949 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y10S901/01
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises mounting flanges to enable robotic insertion and removal from a rack and storage device mounting slots to enable robotic insertion and removal of storage devices into the sled. The storage devices are coupled to an optical fabric through storage resource controllers and a dual-mode optical network interface.
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公开(公告)号:US20180024864A1
公开(公告)日:2018-01-25
申请号:US15395988
申请日:2016-12-30
Applicant: INTEL CORPORATION
Inventor: MYLES WILDE , AARON GORIUS , MICHAEL CROCKER , MOHAN J. KUMAR , DIMITRIOS ZIAKAS
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0613 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0655 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/30036 , G06F9/3887 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F9/544 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F16/9014 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/00 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1442 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/14 , Y02D10/151 , Y02P90/30 , Y04S10/54 , Y10S901/01
Abstract: Examples may include a sled for a rack of a data center including physical compute resources. The sled comprises a processor component and a unitary memory module comprising a memory controller and a quantity of memory based on the processor component. The unitary memory module can comprise a quantity of memory based on a number of cores of processor component to which the unitary memory module is communicably coupled.
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公开(公告)号:US20180024757A1
公开(公告)日:2018-01-25
申请号:US15396151
申请日:2016-12-30
Applicant: INTEL CORPORATION
Inventor: MOHAN J. KUMAR , MURUGASAMY K. NACHIMUTHU , AARON GORIUS , MICHAEL CROCKER
IPC: G06F3/06
Abstract: Examples may include techniques to allocate physical accelerator resources from pools of accelerator resources. In particular, virtual computing devices can be composed from physical resources and physical accelerator resources dynamically allocated to the virtual computing devices. The present disclosure provides that physical accelerator resources can be dynamically allocated, or composed, to a virtual computing device despite not being physically coupled to other components in the virtual device.
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公开(公告)号:US20180024771A1
公开(公告)日:2018-01-25
申请号:US15394338
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: STEVEN C. MILLER , MICHAEL CROCKER , AARON GORIUS , PAUL DORMITZER
CPC classification number: H04Q11/0005 , B25J15/0014 , B65G1/0492 , G02B6/3882 , G02B6/3893 , G02B6/3897 , G02B6/4292 , G02B6/4452 , G05D23/1921 , G05D23/2039 , G06F1/183 , G06F3/061 , G06F3/0611 , G06F3/0613 , G06F3/0616 , G06F3/0619 , G06F3/0625 , G06F3/0631 , G06F3/0638 , G06F3/064 , G06F3/0647 , G06F3/0653 , G06F3/0655 , G06F3/0658 , G06F3/0659 , G06F3/0664 , G06F3/0665 , G06F3/067 , G06F3/0673 , G06F3/0679 , G06F3/0683 , G06F3/0688 , G06F3/0689 , G06F8/65 , G06F9/4401 , G06F9/5016 , G06F9/5044 , G06F9/505 , G06F9/5072 , G06F9/5077 , G06F11/141 , G06F11/3414 , G06F12/0862 , G06F12/0893 , G06F12/10 , G06F12/109 , G06F12/1408 , G06F13/161 , G06F13/1668 , G06F13/1694 , G06F13/4022 , G06F13/4068 , G06F13/409 , G06F13/42 , G06F13/4282 , G06F15/8061 , G06F16/9014 , G06F2209/5019 , G06F2209/5022 , G06F2212/1008 , G06F2212/1024 , G06F2212/1041 , G06F2212/1044 , G06F2212/152 , G06F2212/202 , G06F2212/401 , G06F2212/402 , G06F2212/7207 , G06Q10/06 , G06Q10/06314 , G06Q10/087 , G06Q10/20 , G06Q50/04 , G07C5/008 , G08C17/02 , G08C2200/00 , G11C5/02 , G11C5/06 , G11C7/1072 , G11C11/56 , G11C14/0009 , H03M7/30 , H03M7/3084 , H03M7/3086 , H03M7/40 , H03M7/4031 , H03M7/4056 , H03M7/4081 , H03M7/6005 , H03M7/6023 , H04B10/25 , H04B10/2504 , H04L9/0643 , H04L9/14 , H04L9/3247 , H04L9/3263 , H04L12/2809 , H04L29/12009 , H04L41/024 , H04L41/046 , H04L41/0813 , H04L41/082 , H04L41/0896 , H04L41/12 , H04L41/145 , H04L41/147 , H04L41/5019 , H04L43/065 , H04L43/08 , H04L43/0817 , H04L43/0876 , H04L43/0894 , H04L43/16 , H04L45/02 , H04L45/52 , H04L47/24 , H04L47/38 , H04L47/765 , H04L47/782 , H04L47/805 , H04L47/82 , H04L47/823 , H04L49/00 , H04L49/15 , H04L49/25 , H04L49/357 , H04L49/45 , H04L49/555 , H04L67/02 , H04L67/10 , H04L67/1004 , H04L67/1008 , H04L67/1012 , H04L67/1014 , H04L67/1029 , H04L67/1034 , H04L67/1097 , H04L67/12 , H04L67/16 , H04L67/306 , H04L67/34 , H04L69/04 , H04L69/329 , H04Q1/04 , H04Q11/00 , H04Q11/0003 , H04Q11/0062 , H04Q11/0071 , H04Q2011/0037 , H04Q2011/0041 , H04Q2011/0052 , H04Q2011/0073 , H04Q2011/0079 , H04Q2011/0086 , H04Q2213/13523 , H04Q2213/13527 , H04W4/023 , H04W4/80 , H05K1/0203 , H05K1/181 , H05K5/0204 , H05K7/1418 , H05K7/1421 , H05K7/1422 , H05K7/1447 , H05K7/1461 , H05K7/1485 , H05K7/1487 , H05K7/1489 , H05K7/1491 , H05K7/1492 , H05K7/1498 , H05K7/2039 , H05K7/20709 , H05K7/20727 , H05K7/20736 , H05K7/20745 , H05K7/20836 , H05K13/0486 , H05K2201/066 , H05K2201/10121 , H05K2201/10159 , H05K2201/10189 , Y02D10/14 , Y02D10/151 , Y02P90/30 , Y10S901/01
Abstract: Examples may include a sled for a rack of a data center including physical storage resources. The sled comprises an array of storage devices and an array of memory. The storage devices and memory are directly coupled to storage resource processing circuits which are themselves, directly coupled to dual-mode optical network interface circuitry. The circuitry can store data on the storage devices and metadata associated with the data on non-volatile memory in the memory array.
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