公开(公告)号：US20150318258A1

公开(公告)日：2015-11-05

申请号：US14796759

申请日：2015-07-10

Applicant: INTEL CORPORATION

Inventor： SANDEEP B. SANE ,  Shankar Ganapathysubramanian ,  Jorge Sanchez ,  Leonel R. Arana ,  Eric J. Li ,  Nitin A. Deshpande ,  Jiraporn Seangatith ,  Poh Chieh Benny Poon

IPC: H01L23/00

CPC classification number: H01L24/32 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/89 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/3213 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73253 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/161 ,  H01L2924/16251 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/014

Abstract: Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.

Abstract translation: 控制模具翘曲，用于组装薄模具。 在一个示例中，半导体管芯具有背侧和与背面相对的前侧。 背面具有半导体衬底，并且前侧具有在前侧层上形成在半导体衬底上的部件。 在半导体管芯的背面形成有背面层，以在管芯被加热时抵抗管芯的翘曲，并且在管芯的前侧形成多个接触件以附着到衬底上。