STACKED BUFFER IN TRANSISTORS
    3.
    发明申请

    公开(公告)号:US20220020871A1

    公开(公告)日:2022-01-20

    申请号:US17309583

    申请日:2019-12-05

    Abstract: The present subject matter provides a High Mobility Electron Transistor (HEMT) comprising: a substrate, a nucleation layer provided on the substrate, a channel layer, and a buffer layer formed between the nucleation layer and the channel layer. The buffer layer comprises a vertical stack of p-n junctions. Each p-n junction of the vertical stack of p-n junctions comprises an n-type layer provided on a p-type layer. The n-type layer and the p-type layer are parallel to the substrate.

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