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公开(公告)号：US20230156916A1
公开(公告)日：2023-05-18
申请号：US17938403
申请日：2022-10-06
Applicant: InnoLux Corporation
Inventor： Shang-Ru WU , Hua-Pin CHEN , Shuai WANG , Chien-Hao KUO
CPC classification number: H05K1/111 , H05K1/117 , H05K1/181 , H05K2201/10128 , H05K2201/094 , H05K2201/09409 , H05K2201/09418 , H05K2201/09427 , H05K2201/10287
Abstract: An electronic device is provided, including a working area and a peripheral area. The peripheral area is adjacent to the working area. The peripheral area includes a bonding area. The bonding area includes a first bonding pad area. The first bonding pad area includes a plurality of first bonding pads. A part of the first bonding pads are arranged along a first direction, and another part of the first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.
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公开(公告)号：US20250159805A1
公开(公告)日：2025-05-15
申请号：US19019960
申请日：2025-01-14
Applicant: InnoLux Corporation
Inventor： Shang-Ru WU , Hua-Pin CHEN , Shuai WANG , Chien-Hao KUO
Abstract: An electronic device is provided, including a substrate, and a plurality of first bonding pads. The substrate includes a bonding area. The plurality of first bonding pads are disposed on the substrate and disposed in the bonding area. A part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction. There is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees.
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公开(公告)号：US20230343902A1
公开(公告)日：2023-10-26
申请号：US18186291
申请日：2023-03-20
Applicant: InnoLux Corporation
Inventor： Shang-Ru WU , Shuai WANG , Hua-Pin CHEN , Chien-Hao KUO , Yuan-Yi SUNG , Ta-Wei HUANG
IPC: H01L33/46 , H01L25/075
CPC classification number: H01L33/46 , H01L25/0753 , H01L2933/0025
Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a plurality of light-emitting elements, and a reflective structure. A plurality of light-emitting elements is disposed on the substrate. The reflective structure is disposed on the substrate and located between adjacent two of the plurality of light-emitting elements. The thickness of the reflective structure is designated as Y1, half of a pitch between the adjacent two of the plurality of light-emitting elements is designated as X1, and the light that is emitted by one of the adjacent two of the plurality of light-emitting elements has an emitting angle, and half of the emitting angle is designated as θ. X1, θ, and Y1 conform to the following relationship: X1×0.5×tan(90−θ)≤Y1≤X1×1.8×tan(90−θ).
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