公开(公告)号：US20230027076A1

公开(公告)日：2023-01-26

申请号：US17956612

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Eric Buddrius ,  Jeffory Smalley ,  Fernando Gonzalez Lenero ,  Francisco Javier Colorado Alonso ,  Fatima Elias Flores ,  Rolf Laido

IPC: H01L23/40 ,  H01L21/48 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

公开(公告)号：US10720783B2

公开(公告)日：2020-07-21

申请号：US15756053

申请日：2015-09-25

Applicant: Intel Corporation ,  Stephen John Allen ,  Gregory A. Peek ,  Yoshifumi Nishi ,  Rolf Laido ,  Shaun Gerrit Immeker ,  Kerry A. Stevens ,  Andrew Larson ,  Ralph V. Miele ,  Kimi Jensen ,  Duck Young Kong ,  Dan H. Gerbus

Inventor： Stephen John Allen ,  Gregory A. Peek ,  Yoshifumi Nishi ,  Rolf Laido ,  Shaun Gerrit Immeker ,  Kerry A. Stevens ,  Andrew Larson ,  Ralph V. Miele ,  Kimi Jensen ,  Duck Young Kong ,  Dan H. Gerbus

IPC: H02J7/02 ,  H02J7/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40

Abstract: Particular embodiments described herein provide for an electronic device, that includes a first housing and a wireless charging stand. The first housing can include a display. The wireless charging stand can include a power receiving unit and is configured to wireless charge the electronic device and support the first housing at different viewing angles of the display.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H01L23/40 ,  H05K7/14 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11296009B2

公开(公告)日：2022-04-05

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02 ,  H01R13/629 ,  H05K7/20

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

公开(公告)号：US20180358826A1

公开(公告)日：2018-12-13

申请号：US15756053

申请日：2015-09-25

Applicant: Stephen John ALLEN ,  Gregory A. PEEK ,  Yoshifumi NISHI ,  Rolf LAIDO ,  Shaun Gerrit IMMEKER ,  Kerry A. STEVENS ,  Andrew LARSON ,  Ralph V. MIELE ,  Kimi JENSEN ,  Duck Young KONG ,  Dan H. GERBUS ,  Intel Corporation

Inventor： Stephen John Allen ,  Gregory A. Peek ,  Yoshifumi Nishi ,  Rolf Laido ,  Shaun Gerrit Immeker ,  Kerry A. Stevens ,  Andrew Larson ,  Ralph V. Miele ,  Kimi Jensen ,  Duck Young Kong ,  Dan H. Gerbus

IPC: H02J7/00 ,  H02J7/02 ,  H02J50/12 ,  H02J50/40

Abstract: Particular embodiments described herein provide for an electronic device, that includes a first housing and a wireless charging stand. The first housing can include a display. The wireless charging stand can include a power receiving unit and is configured to wireless charge the electronic device and support the first housing at different viewing angles of the display.

公开(公告)号：US11818832B2

公开(公告)日：2023-11-14

申请号：US16828447

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Feroz Mohammad ,  Ralph V. Miele ,  Thomas Boyd ,  Steven A. Klein ,  Gregorio R. Murtagian ,  Eric W. Buddrius ,  Daniel Neumann ,  Rolf Laido

IPC: H05K1/02 ,  H01R12/85 ,  H05K7/20 ,  H01L23/40 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K7/20509 ,  H01L2023/405 ,  H01L2023/4087 ,  H01R12/85 ,  H05K1/181 ,  H05K2201/10325

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC: H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H05K7/14 ,  H01L23/40 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US20190304871A1

公开(公告)日：2019-10-03

申请号：US15942275

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Rolf Laido ,  Divya Swamy Bandaru ,  Thomas Boyd ,  Jorge Contreras Perez ,  Shelby A. Ferguson ,  Mustafa Haswarey

IPC: H01L23/40 ,  H05K1/02

Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.