公开(公告)号：US20250024622A1

公开(公告)日：2025-01-16

申请号：US18897941

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Richard Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  Garrett Frans Pauwels ,  Emery Evon Frey ,  Steven Adam Klein ,  Daniel Neumann

IPC: H05K7/10 ,  H01R12/57 ,  H01R13/11 ,  H01R13/405

Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.

公开(公告)号：US12127363B2

公开(公告)日：2024-10-22

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Thomas Boyd ,  Kuang Liu ,  Steven A. Klein ,  Daniel Neumann ,  Mohanraj Prabhugoud

IPC: H05K7/10 ,  H01R12/52

CPC classification number: H05K7/1069 ,  H01R12/523

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US11818832B2

公开(公告)日：2023-11-14

申请号：US16828447

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Feroz Mohammad ,  Ralph V. Miele ,  Thomas Boyd ,  Steven A. Klein ,  Gregorio R. Murtagian ,  Eric W. Buddrius ,  Daniel Neumann ,  Rolf Laido

IPC: H05K1/02 ,  H01R12/85 ,  H05K7/20 ,  H01L23/40 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K7/20509 ,  H01L2023/405 ,  H01L2023/4087 ,  H01R12/85 ,  H05K1/181 ,  H05K2201/10325

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC: H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US20230019643A1

公开(公告)日：2023-01-19

申请号：US17956598

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Daniel Neumann ,  Andrew Larson ,  Eric Buddrius ,  Jeffory Smalley ,  Shelby Ferguson

IPC: H05K5/02

Abstract: Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.

公开(公告)号：US20250112392A1

公开(公告)日：2025-04-03

申请号：US18980411

申请日：2024-12-13

Applicant: Intel Corporation

Inventor： Richard Canham ,  Ernesto Borboa Lizarraga ,  Daniel Neumann ,  Shelby Ferguson ,  Eric Buddrius ,  Hardikkumar Prajapati ,  Kirk Wheeler ,  Steven Klein ,  Shaun Immeker ,  Jeffory L. Smalley

IPC: H01R12/85

Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.