公开(公告)号：US12218052B2

公开(公告)日：2025-02-04

申请号：US18384582

申请日：2023-10-27

Applicant: Intel Corporation

Inventor： Richard E. Schenker ,  Robert L Bristol ,  Kevin L. Lin ,  Florian Gstrein ,  James M. Blackwell ,  Marie Krysak ,  Manish Chandhok ,  Paul A Nyhus ,  Charles H. Wallace ,  Curtis W. Ward ,  Swaminathan Sivakumar ,  Elliot N. Tan

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L27/088 ,  H01L29/78

Abstract: Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.