公开(公告)号：US09984992B2

公开(公告)日：2018-05-29

申请号：US14997774

申请日：2016-01-18

Applicant: Invensas Corporation

Inventor： Javier A. DeLaCruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/17 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0284 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US20180240773A1

公开(公告)日：2018-08-23

申请号：US15959619

申请日：2018-04-23

Applicant: Invensas Corporation

Inventor： Javier A. Delacruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC: H01L23/00 ,  H05K1/02 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/17 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/96 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0284 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US09530749B2

公开(公告)日：2016-12-27

申请号：US14698684

申请日：2015-04-28

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Willmar Subido ,  Hoang Nguyen ,  Marjorie Cara ,  Wael Zohni ,  Christopher W. Lattin

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H05K1/11 ,  H05K1/14 ,  H01L23/00 ,  B81B7/00 ,  B81C1/00 ,  B23K20/00

CPC classification number: H01L24/49 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/05 ,  B81C1/00301 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Abstract translation: 一种装置一般涉及微机电系统部件。 在这种装置中，微机电系统部件具有下表面，上表面，第一侧表面和第二侧表面。 第一侧面的表面积大于第二侧面的表面积。 微电子机械系统部件具有多个连接到第一侧表面的第一侧表面并且远离第一侧表面的线接合线。 线接合线相对于第一侧表面的第一侧表面是自支撑的和悬臂的。

公开(公告)号：US10325877B2

公开(公告)日：2019-06-18

申请号：US15959619

申请日：2018-04-23

Applicant: Invensas Corporation

Inventor： Javier A. Delacruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC: H01L23/00 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/552 ,  H01L25/10 ,  H01L25/00

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US20170194281A1

公开(公告)日：2017-07-06

申请号：US14997774

申请日：2016-01-18

Applicant: Invensas Corporation

Inventor： Javier A. DeLaCruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L24/49 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/17 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0284 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US20160049383A1

公开(公告)日：2016-02-18

申请号：US14532806

申请日：2014-11-04

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hong Shen ,  Christopher W. Lattin ,  Guilian Gao ,  Rajesh Katkar

IPC: H01L25/065 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/11003 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/14517 ,  H01L2224/14519 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17517 ,  H01L2224/17519 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/185 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device and method for an integrated device includes a first redistribution layer comprising one or more first conductors, one or more first dies mounted to a first surface of the first redistribution layer and electrically coupled to the first conductors, one or more first posts having first ends attached to the first dies and second ends opposite the first ends, one or more second posts having third ends attached to the first surface of the first redistribution layer and fourth ends opposite the third ends, and a second redistribution layer comprising one or more second conductors, the second redistribution layer being attached to the second ends of the first posts and to the fourth ends of the second posts. In some embodiments, the integrated device further includes a heat spreader mounted to a second surface of the first redistribution layer. The second surface is opposite the first surface.

Abstract translation: 一种用于集成器件的器件和方法包括：第一再分配层，其包括一个或多个第一导体，一个或多个第一裸片，其安装到第一再分布层的第一表面并电耦合到第一导体，一个或多个第一柱具有第一导体 末端附接到第一模具和与第一端相对的第二端，一个或多个第二柱，其具有附接到第一再分布层的第一表面的第三端和与第三端相对的第四端，以及包括一个或多个第二端的第二再分布层 导体，第二再分布层附接到第一柱的第二端和第二柱的第四端。 在一些实施例中，集成装置还包括安装到第一再分配层的第二表面的散热器。 第二表面与第一表面相对。