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公开(公告)号：US11191169B2
公开(公告)日：2021-11-30
申请号：US17038982
申请日：2020-09-30
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20240008189A1
公开(公告)日：2024-01-04
申请号：US18468984
申请日：2023-09-18
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , H01L23/00 , H05K3/36 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00
CPC classification number: H05K3/3494 , H01L24/80 , H05K3/361 , H05K3/363 , B23K20/025 , B23K20/233 , H01L21/84 , H05K1/117 , B23K20/007 , B23K20/24 , B23K35/0222 , B23K35/3013 , H05K1/111 , H05K3/321 , H05K3/4015 , H05K13/0015 , B23K2101/42
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20210014977A1
公开(公告)日：2021-01-14
申请号：US17038982
申请日：2020-09-30
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , H01L23/00 , H05K3/36 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US12185476B2
公开(公告)日：2024-12-31
申请号：US18468984
申请日：2023-09-18
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , B23K20/00 , B23K20/02 , B23K20/233 , B23K20/24 , B23K35/02 , B23K35/30 , H01L21/84 , H01L23/00 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20220095463A1
公开(公告)日：2022-03-24
申请号：US17504812
申请日：2021-10-19
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , H01L23/00 , H05K3/36 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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Patent Agency Ranking
公开(公告)号：US11765837B2
公开(公告)日：2023-09-19
申请号：US17504812
申请日：2021-10-19
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
CPC classification number: H05K3/3494 , B23K20/007 , B23K20/025 , B23K20/233 , B23K20/24 , B23K35/0222 , B23K35/3013 , H01L21/84 , H01L24/80 , H05K1/111 , H05K1/117 , H05K3/321 , H05K3/361 , H05K3/363 , H05K3/4015 , H05K13/0015 , B23K2101/42 , B23K2103/08 , B32B37/06 , H05K2203/049 , H05K2203/166 , Y02P70/50 , Y02P70/62
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US11009561B2
公开(公告)日：2021-05-18
申请号：US16360856
申请日：2019-03-21
Applicant: Jabil Inc.
Inventor： Wieslaw Mariusz Januszko , Hien Ly , Jennifer Lindsey Gamboa , Vincy Wan Sze Li , Corey Matthew Smith
Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.
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公开(公告)号：US20200300904A1
公开(公告)日：2020-09-24
申请号：US16360856
申请日：2019-03-21
Applicant: Jabil Inc.
Inventor： Wieslaw Mariusz Januszko , Hien Ly , Jennifer Lindsey Gamboa , Vincy Wan Sze Li , Corey Matthew Smith
Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.
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公开(公告)号：US10813230B2
公开(公告)日：2020-10-20
申请号：US16561998
申请日：2019-09-05
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20190394885A1
公开(公告)日：2019-12-26
申请号：US16561998
申请日：2019-09-05
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K1/11 , H05K3/32 , H05K3/40 , H05K13/00
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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