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公开(公告)号：US11765837B2
公开(公告)日：2023-09-19
申请号：US17504812
申请日：2021-10-19
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
CPC classification number: H05K3/3494 , B23K20/007 , B23K20/025 , B23K20/233 , B23K20/24 , B23K35/0222 , B23K35/3013 , H01L21/84 , H01L24/80 , H05K1/111 , H05K1/117 , H05K3/321 , H05K3/361 , H05K3/363 , H05K3/4015 , H05K13/0015 , B23K2101/42 , B23K2103/08 , B32B37/06 , H05K2203/049 , H05K2203/166 , Y02P70/50 , Y02P70/62
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20240008189A1
公开(公告)日：2024-01-04
申请号：US18468984
申请日：2023-09-18
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , H01L23/00 , H05K3/36 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00
CPC classification number: H05K3/3494 , H01L24/80 , H05K3/361 , H05K3/363 , B23K20/025 , B23K20/233 , H01L21/84 , H05K1/117 , B23K20/007 , B23K20/24 , B23K35/0222 , B23K35/3013 , H05K1/111 , H05K3/321 , H05K3/4015 , H05K13/0015 , B23K2101/42
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US11233353B2
公开(公告)日：2022-01-25
申请号：US16867236
申请日：2020-05-05
Applicant: JABIL INC.
Inventor： Wenlu Wang , Marcel Moortgat
IPC: H01R13/516 , H05K1/11 , H01R13/631
Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.
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公开(公告)号：US20210014977A1
公开(公告)日：2021-01-14
申请号：US17038982
申请日：2020-09-30
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , H01L23/00 , H05K3/36 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US12288943B2
公开(公告)日：2025-04-29
申请号：US17924086
申请日：2021-05-05
Applicant: JABIL INC.
Inventor： Marcel Moortgat , Wenlu Wang
IPC: H01R13/516 , H01R13/631 , H05K1/11
Abstract: An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.
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Patent Agency Ranking
公开(公告)号：US11191169B2
公开(公告)日：2021-11-30
申请号：US17038982
申请日：2020-09-30
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08 , B32B37/06
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US10813230B2
公开(公告)日：2020-10-20
申请号：US16561998
申请日：2019-09-05
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , H01L23/00 , B23K20/02 , B23K20/233 , H01L21/84 , H05K1/11 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K3/32 , H05K3/40 , H05K13/00 , B23K101/42 , B23K103/08
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US20190394885A1
公开(公告)日：2019-12-26
申请号：US16561998
申请日：2019-09-05
Applicant: Jabil Inc.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/34 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K1/11 , H05K3/32 , H05K3/40 , H05K13/00
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US10448517B2
公开(公告)日：2019-10-15
申请号：US15344101
申请日：2016-11-04
Applicant: JABIL INC.
Inventor： Wenlu Wang , Mark A. Tudman , Michael Piring Santos , Ross Kristensen Benz , Hien Ly , Gary Fang
IPC: H05K3/36 , H05K3/34 , B23K20/00 , B23K20/24 , B23K35/02 , B23K35/30 , H05K1/11 , H05K3/32 , H05K3/40 , H05K13/00 , B23K20/02 , B23K20/233 , H01L21/84 , H01L23/00 , B23K101/42 , B23K103/08
Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
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公开(公告)号：US12228771B2
公开(公告)日：2025-02-18
申请号：US17270799
申请日：2018-09-04
Applicant: JABIL INC.
Inventor： Wenlu Wang , Marcel Moortgat
Abstract: An apparatus, system and method of providing a tray suitable for holding an optoelectronic device during printed circuit board manufacturing processes. The apparatus, system and method includes a tray body having an inset for receiving the optoelectronic device; a plurality of positioners for the optoelectronic device within the inset; and a guide channel about a perimeter of the tray body suitable for receiving optical fibers of the optoelectronic device when the optoelectronic device is received in the inset, the guide channel comprising at least one retainer for retaining received ones of the optical fibers therewithin.
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