公开(公告)号：US20110023291A1

公开(公告)日：2011-02-03

申请号：US12848089

申请日：2010-07-30

Applicant: James Peter Caska

Inventor： James Peter Caska

IPC: B23P19/00

CPC classification number: H05K1/0287 ,  H05K1/0289 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10303 ,  Y10T29/53174

Abstract: An integrated method of prototyping and manufacturing electronic circuit boards where a new circuit design can move between virtual, prototype, partially merged and fully merged forms in a relatively automated fashion. A scaleable high density matrix of solderless electrical connections between the pin-outs of a plurality of electronic modules forms a virtual breadboard prototype circuit that can be merged into printed circuit board electrical layers to thus directly synthesize manufacturable forms of prototyped electronic circuits.

Abstract translation: 一种电子电路板的原型和制造的集成方法，其中新的电路设计可以以相对自动化的方式在虚拟，原型，部分合并和完全合并之间移动。 多个电子模块的引脚之间的无焊接电连接的可扩展高密度矩阵形成虚拟面包板原型电路，其可以被合并到印刷电路板电层中，从而直接合成可制造形式的原型电子电路。