Abstract:
This disclosure is concerned with optical packages. In one example, a package for an optical device includes a substrate that supports an optical device. A window of the package covers the portion of the substrate that supports the optical device. Additionally, the window forms a hermetic seal for the supported optical device.
Abstract:
A force sensor includes a first surface and a second surface located opposite the first surface, the first surface translatable against a resilient force in a direction towards and/or from the second surface; a distance sensor, arranged to measure the distance between the first surface and the second surface; characterized in that the force sensor comprises a flexible coupling extending along the direction, flexibly coupling the first surface to the second surface; and in that the flexible coupling is provided with a resilient means to provide the resilient force; and a space encompassed by the flexible coupling together with the first surface and the second surface being accessible to the distance sensor, the space filled with a medium for providing the resilient force.
Abstract:
A force sensor and corresponding force monitoring mattress is provided. The force sensor (100) comprises: a first surface (102) and a second surface (104) located opposite the first surface (102), the first surface (102) is translatable against a resilient force in a direction towards and/or from the second surface (104); a distance sensor (110), arranged to measure the distance between the first surface (102) and the second surface (104). The force sensor comprises a flexible coupling (108) extending along the direction, flexibly coupling the first surface (102) to the second surface (104). The flexible coupling (108) is provided with a resilient means (106) to provide the resilient force.
Abstract:
A semiconductor laser having a buried hetero junction, more particularly a DCPBH laser, in which the active layer (3) is located in a "mesa", which is laterally bounded by a boundary region comprising at least one blocking layer (6) having a larger band gap than the active layer. The boundary region includes an absorption layer (13) having a smaller band gap than the active layer, this absorption layer being located at such a small lateral distance from the active layer that it lies within the amplification profile of the first-order lateral oscillation mode. As a result, the first and higher oscillation modes as well as the thyristor effect are suppressed.
Abstract:
A sensor for identifying at least one particle by means of Raman-spectroscopy, comprising an optical trapping system for the at least one particle, including a laser-beam source, acting further as a Raman excitation source for the at least one particle, and a Raman-spectrometer for measuring the spectrally modified light scattered by the at least one particle and for identifying same, wherein the optical trapping system comprises a photonic crystal directly linked with the laser-beam source, which photonic crystal has multiple cavities at predetermined positions, and wherein the laser-beam source in use resonantly excites one or more predetermined electromagnetic modes of the cavities at said positions for trapping and Raman-exciting the at least one particle.
Abstract:
A sensor for identifying at least one particle by means of Raman-spectroscopy, comprising an optical trapping system for the at least one particle, including a laser-beam source, acting further as a Raman excitation source for the at least one particle, and a Raman-spectrometer for measuring the spectrally modified light scattered by the at least one particle and for identifying same, wherein the optical trapping system comprises a photonic crystal directly linked with the laser-beam source, which photonic crystal has multiple cavities at predetermined positions, and wherein the laser-beam source in use resonantly excites one or more predetermined electromagnetic modes of the cavities at said positions for trapping and Raman-exciting the at least one particle.
Abstract:
Method and system for an optical package are disclosed. In one embodiment of the present invention, an optical package comprises: a lead frame; a substrate mounted inside the lead frame; one or more leads attached to the substrate; an optical device or component such as a LOA chip mounted on top of the substrate; a window cap hermetically sealing the optical device or component; one or more lens attached to either side of the window cap; two fibers attached on either side of the window cap; two holes or vias that may serve as inputs into the window cap or outputs from the window cap; an electrical out extending from the window cap; and an electrically isolated enclosure enveloping all contents inside the lead frame.