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公开(公告)号:US20160295731A1
公开(公告)日:2016-10-06
申请号:US15087163
申请日:2016-03-31
Applicant: Japan Display Inc.
Inventor: Yuuki NISHIMOTO
IPC: H05K7/02
CPC classification number: G02F1/13452
Abstract: A display device includes a display panel and a flexible wiring board, an end. portion of which is joined to the display panel. The flexible wiring board includes a flexible base substrate in which a through-hole is formed in a position not overlapping the display panel of an extending portion extending from the end portion joined to the display panel in plan view, a first wiring pattern. formed. to close the through-hole on one surface of the flexible base substrate, and a first resin layer having more flexibility than the flexible base substrate and formed to fill the through-hole formed in the flexible base substrate.
Abstract translation: 显示装置包括显示面板和柔性布线板,端部。 其一部分连接到显示面板。 柔性布线基板包括柔性基底基底,其中通孔形成在与从俯视图中接合到显示面板的端部延伸的延伸部分的显示面板不重叠的位置,第一布线图案。 形成。 以封闭柔性基底基板的一个表面上的通孔,以及形成为具有比柔性基底基板更大的柔性的第一树脂层,并且形成为填充形成在柔性基底基板中的通孔。
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公开(公告)号:US20170273177A1
公开(公告)日:2017-09-21
申请号:US15418991
申请日:2017-01-30
Applicant: Japan Display Inc.
Inventor: Yuuki NISHIMOTO
CPC classification number: H05K1/0281 , H05K1/0271 , H05K1/115 , H05K1/118 , H05K1/189 , H05K2201/0154 , H05K2201/068 , H05K2201/10128 , H05K2201/10681
Abstract: A flexible circuit board includes a base material including a first surface and a second surface opposite the first surface, the base material including a conductor layer, a first insulating film covering the first surface of the base material and formed with a first opening, a first insulating member formed inside the first opening and formed with a connection port to expose the conductor layer, the first insulating member having a thermal expansion coefficient smaller than that of the first insulating film, a second insulating film covering the second surface of the base material and formed with a second opening overlapping at least a portion of the first opening in a plan view, and a second insulating member formed inside the second opening and having a thermal expansion coefficient smaller than that of the first insulating film.
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