公开(公告)号：US20120201267A1

公开(公告)日：2012-08-09

申请号：US13190394

申请日：2011-07-25

Applicant: KAILASH Kiran PATALAY

Inventor： KAILASH Kiran PATALAY

IPC: G01K15/00

CPC classification number: G01J5/0007 ,  G01J5/0846 ,  G01J5/0862 ,  G01J5/12 ,  G01J5/20 ,  G01J5/524 ,  G01J2005/0051

Abstract: Embodiments of the present invention generally relate to methods and apparatus for measuring, calibrating, and controlling substrate temperature during low temperature and high temperature processing. In one embodiment, the method includes epitaxially forming a layer stack on a substrate placed on a support plate, measuring a temperature of the substrate with a first pyrometer disposed over the substrate, measuring a temperature of the support plate with a second pyrometer disposed below the support plate, calibrating the first pyrometer at multiple temperature points based on actual temperature readings of the substrate to generate a first set of calibrated temperature readings associated with the substrate, calibrating the second pyrometer using the set of calibrated temperature readings as a reference to generate a second set of calibrated temperature readings associated with the support plate, and controlling a power supplied to a heat source configured to heat the substrate based on the second set of calibrated temperature readings.

Abstract translation: 本发明的实施例一般涉及用于在低温和高温处理期间测量，校准和控制衬底温度的方法和装置。 在一个实施例中，该方法包括在放置在支撑板上的基板上外延地形成层叠层，用设置在基板上的第一高温计测量基板的温度，用设置在基板上方的第二高温计测量支撑板的温度 基于基板的实际温度读数在多个温度点校准第一高温计，以产生与衬底相关联的第一组校准温度读数，使用该组校准温度读数校准第二高温计作为参考，以生成 与支撑板相关联的第二组校准温度读数，以及基于第二组校准温度读数来控制提供给配置成加热衬底的热源的功率。