公开(公告)号：US20210359276A1

公开(公告)日：2021-11-18

申请号：US17193769

申请日：2019-09-05

Applicant: KANEKA CORPORATION

Inventor： Hirofumi Inari ,  Hiroshi Yoshimoto ,  Masahito Ide ,  Takao Manabe

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: The present disclosure is directed to a light-shielding colored resin layer formed on a substrate, and a patterned protective layer formed on the colored resin layer. By removing the colored resin layer exposed in an opening of the protective layer by dry etching, thereby patterning the colored resin layer, a partition wall in which the protective layer is provided on a patterned colored resin layer is formed. This partition wall partitions the display surface of an image display device into a plurality of regions; and an image display device is formed by filling spaces, which are partitioned by the partition wall, with a color developing material.

公开(公告)号：US09588425B2

公开(公告)日：2017-03-07

申请号：US15288722

申请日：2016-10-07

Applicant: KANEKA CORPORATION

Inventor： Masahito Ide ,  Hirofumi Inari ,  Aki Kitajima ,  Komei Tahara ,  Takao Manabe

IPC: G03F7/004 ,  G03F7/075 ,  H01L29/51 ,  H01L29/423 ,  C07F7/18 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L29/786 ,  H01L29/66 ,  H01L21/441 ,  H01L23/29 ,  H01L21/033 ,  G03F7/039 ,  H01L51/05 ,  H01L51/00 ,  G03F7/027 ,  H01L21/02 ,  C08G77/388 ,  C08K5/549

CPC classification number: G03F7/0755 ,  C07F7/1804 ,  C08G77/388 ,  C08K5/549 ,  G03F7/027 ,  G03F7/0392 ,  G03F7/0757 ,  G03F7/162 ,  G03F7/20 ,  G03F7/322 ,  G03F7/40 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/0332 ,  H01L21/441 ,  H01L23/293 ,  H01L29/42364 ,  H01L29/51 ,  H01L29/66969 ,  H01L29/7869 ,  H01L51/0094 ,  H01L51/0508

Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.

Abstract translation: 本发明的目的在于提供具有优异的图案化特性的正型光敏组合物，并且在固化时（作为薄膜）可以表现出优异的电绝缘可靠性。 根据本发明第一方面的正型光敏组合物的特征在于包括（A）在分子内含有烯基或SiH基的化合物，并且具有在酸存在下分解以产生酸性基团的结构 或羟基; （B）分子内含有SiH基或烯基的化合物; （C）氢化硅烷化催化剂; 和（D）光致酸产生剂。

公开(公告)号：US09422405B2

公开(公告)日：2016-08-23

申请号：US14689424

申请日：2015-04-17

Applicant: KANEKA CORPORATION

Inventor： Takao Manabe ,  Makoto Seino ,  Shinya Mizuta

IPC: C08L83/04 ,  C08G77/38 ,  C08F230/08 ,  C07F7/21 ,  C08G77/04 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C09D183/04 ,  C08K3/36 ,  G02B1/04 ,  G02B1/10 ,  C08G77/12 ,  C08K5/56

CPC classification number: C08G77/38 ,  C07F7/21 ,  C08F230/08 ,  C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08K5/56 ,  C09D183/04 ,  G02B1/04 ,  G02B1/10 ,  C08L83/00

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

公开(公告)号：US09793456B2

公开(公告)日：2017-10-17

申请号：US14344075

申请日：2012-09-26

Applicant: KANEKA CORPORATION

Inventor： Tomokazu Tozawa ,  Takahisa Iwahara ,  Hiroshi Ogoshi ,  Kazuhiko Hirabayashi ,  Shuhei Ozaki ,  Satoaki Iba ,  Kazuaki Kanai ,  Yasushi Kakehashi ,  Takao Manabe ,  Mitsuhiro Hori ,  Ryoichi Narita

IPC: H01L33/62 ,  H01L33/60 ,  B29C45/14 ,  B29C45/37 ,  C08L83/04 ,  H01L23/00 ,  H05K13/00 ,  C08G77/54 ,  C08K5/3492 ,  C08G77/12 ,  C08G77/20 ,  C08G77/14

CPC classification number: H01L33/62 ,  B29C45/14655 ,  B29C45/372 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/54 ,  C08K5/34924 ,  C08L83/04 ,  H01L24/97 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K13/00 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L83/00 ,  C08L83/14

Abstract: A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

公开(公告)号：US20150008455A1

公开(公告)日：2015-01-08

申请号：US14344075

申请日：2012-09-26

Applicant: KANEKA CORPORATION

Inventor： Tomokazu Tozawa ,  Takahisa Iwahara ,  Hiroshi Ogoshi ,  Kazuhiko Hirabayashi ,  Shuhei Ozaki ,  Satoaki Iba ,  Kazuaki Kanai ,  Yasushi Kakehashi ,  Takao Manabe ,  Mitsuhiro Hori ,  Ryoichi Narita

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H05K13/00

CPC classification number: H01L33/62 ,  B29C45/14655 ,  B29C45/372 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/54 ,  C08K5/34924 ,  C08L83/04 ,  H01L24/97 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K13/00 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L83/00 ,  C08L83/14

Abstract: A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract translation: 用于表面安装发光装置的模制树脂体具有与多个引线一体模制的固化树脂体和在底部暴露多个引线的凹部，其中十点平均粗糙度（Rz ）为1〜10μm，固化树脂体的玻璃化转变温度为10℃以上，玻璃化转变温度为使用热机械分析仪（TMS）测定的值 温度范围为-50至250℃，升温速率为5℃/分钟，样品尺寸长度为1至5mm的条件，以及在460nm的光学反射率 凹部为80％以上，在180℃下加热72小时后的开口面的光反射率保持率为90％以上。

公开(公告)号：US20230155034A1

公开(公告)日：2023-05-18

申请号：US18157082

申请日：2023-01-20

Applicant: KANEKA CORPORATION

Inventor： Hirofumi Inari ,  Hiroshi Yoshimoto ,  Masahito Ide ,  Takao Manabe

IPC: H01L29/786 ,  H01L29/417 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L29/41733 ,  H01L29/66742

Abstract: A thin-film transistor element including a gate layer, an oxide semiconductor thin-film, a gate insulating film disposed between the gate layer and the oxide semiconductor thin-film, a pair of source-drain electrodes electrically connected to the oxide semiconductor thin-film, and a resin film covering the oxide semiconductor thin-film is provided. The oxide semiconductor thin-film contains two or more metal elements selected from indium, gallium, zinc, and tin. The resin film is in contact with the oxide semiconductor thin-film. The resin film may include a compound that contains a SiH group. The resin film may be formed by applying a composition including a SiH group-containing compound onto the oxide semiconductor thin-film, and heating the composition.

公开(公告)号：US09416231B2

公开(公告)日：2016-08-16

申请号：US14689454

申请日：2015-04-17

Applicant: KANEKA CORPORATION

Inventor： Takao Manabe ,  Makoto Seino ,  Shinya Mizuta

IPC: C08L83/04 ,  C08G77/38 ,  C08F230/08 ,  C07F7/21 ,  C08G77/04 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C09D183/04 ,  C08K3/36 ,  G02B1/04 ,  G02B1/10 ,  C08G77/12 ,  C08K5/56

CPC classification number: C08G77/38 ,  C07F7/21 ,  C08F230/08 ,  C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08K5/56 ,  C09D183/04 ,  G02B1/04 ,  G02B1/10 ,  C08L83/00

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

公开(公告)号：US09035009B2

公开(公告)日：2015-05-19

申请号：US13770089

申请日：2013-02-19

Applicant: KANEKA CORPORATION

Inventor： Takao Manabe ,  Makoto Seino ,  Shinya Mizuta

IPC: C08G77/20 ,  C07F7/21 ,  C08F230/08 ,  C08G77/04 ,  C08G77/14 ,  C08G77/50 ,  C09D183/04 ,  C08G77/12 ,  C08K5/56

CPC classification number: C08G77/38 ,  C07F7/21 ,  C08F230/08 ,  C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08K5/56 ,  C09D183/04 ,  G02B1/04 ,  G02B1/10 ,  C08L83/00

Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).

Abstract translation: 本发明的目的是提供一种成型性和透明性优异的多面体聚硅氧烷的液态改性产物和使用该改性产物制备的组合物。 此外，本发明可以提供易于处理的改性产品和组合物。 本发明提供通过用化合物（b）改性多面体聚硅氧烷化合物（a）和含有该改性产物的组合物得到的多面体聚硅氧烷的改性产物。 多面体聚硅氧烷化合物（a）具有烯基和/或氢化甲硅烷基，化合物（b）具有能够与（a）成分氢化硅烷化的氢化硅烷基和/或烯基。

公开(公告)号：US10976663B2

公开(公告)日：2021-04-13

申请号：US16337470

申请日：2017-09-21

Applicant: KANEKA CORPORATION

Inventor： Hirofumi Inari ,  Susumu Amano ,  Aki Kitajima ,  Yoshikatsu Ichiryu ,  Masahito Ide ,  Takao Manabe

IPC: G03F7/075 ,  G03F7/004 ,  G03F7/038 ,  C08G77/388 ,  G02B5/20 ,  C08G59/20

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

公开(公告)号：US09688851B2

公开(公告)日：2017-06-27

申请号：US14674718

申请日：2015-03-31

Applicant: KANEKA CORPORATION

Inventor： Yoshitaka Nishiyama ,  Hiroyuki Tanaka ,  Satoshi Sugiyama ,  Takao Manabe

IPC: C08L43/04 ,  C08G77/38 ,  C08L83/14 ,  C08K5/5425 ,  H01L33/56 ,  C08G77/20

CPC classification number: C08L43/04 ,  C08G77/20 ,  C08G77/38 ,  C08K5/5425 ,  C08K2201/008 ,  C08L83/00 ,  C08L83/14 ,  C08L2201/02 ,  C08L2201/14 ,  C08L2203/206 ,  C08L2205/025 ,  H01L33/56

Abstract: The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.