公开(公告)号：US10825851B2

公开(公告)日：2020-11-03

申请号：US16390280

申请日：2019-04-22

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Sheng Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Jo-Wei Yang ,  Chien-Chen Lee ,  Jian-Ru Chen

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/04

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.