公开(公告)号：US5799392A

公开(公告)日：1998-09-01

申请号：US653401

申请日：1996-05-24

Applicant: Kinuko Mishiro

Inventor： Kinuko Mishiro

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K2201/10977 ,  H05K3/281 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A method of manufacturing a connecting structure of first and second printed wiring boards each having an electrode for conductively connecting to each other using a conductive film. A first printed wiring board with a resist film bonds to a second printed wiring board directly or using conductive film or bonding film. Both electrodes can be bonded using a conductive film and/or a bonding film. The resist film on one printed wiring board can be bonded to the electrode of another printed wiring board using a conductive film, or both resist films can be bonded using a conductive film.

Abstract translation: 一种制造第一和第二印刷电路板的连接结构的方法，每个印刷电路板具有使用导电膜彼此导电连接的电极。 具有抗蚀剂膜的第一印刷线路板直接接合到第二印刷线路板或者使用导电膜或接合膜。 可以使用导电膜和/或接合膜来接合两个电极。 一个印刷线路板上的抗蚀剂膜可以使用导电膜粘合到另一个印刷线路板的电极，或者两个抗蚀剂膜可以使用导电膜接合。

公开(公告)号：US20070063324A1

公开(公告)日：2007-03-22

申请号：US11319656

申请日：2005-12-29

Applicant: Kinuko Mishiro ,  Ken-ichiro Tsubone

Inventor： Kinuko Mishiro ,  Ken-ichiro Tsubone

IPC: H01L23/02

CPC classification number: H01L21/4871 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/10253 ,  H05K1/0231 ,  H05K1/0271 ,  H05K3/3415 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/047 ,  Y02P70/613 ,  H01L2924/00

Abstract: A warp reducing member is bonded to an area on one surface of the substrate corresponding to other side of an electronic part for which the warp is to be reduced with respect to a substrate. An external size of the warp reducing member is substantially same as a size of each of a plurality of electronic parts or large enough to include multiple electronic parts. The warp reducing member is bonded to the substrate with a bonding material having a melting point lower than that of other bonding material that electrically connects the electronic parts to the substrate.

Abstract translation: 翘曲减少构件被结合到基板的一个表面上的相对于基板相对于要减薄的电子部件的另一侧的区域。 翘曲减少构件的外部尺寸基本上与多个电子部件的尺寸相同或足够大以包括多个电子部件。 翘曲减少构件用熔点低于将电子部件与基板电连接的其他接合材料的熔点低的接合材料接合到基板。

公开(公告)号：US20050224252A1

公开(公告)日：2005-10-13

申请号：US10921196

申请日：2004-08-19

Applicant: Kinuko Mishiro

Inventor： Kinuko Mishiro

IPC: H05K1/18 ,  B23K35/12 ,  H01L21/60 ,  H01L23/00 ,  H01L23/04 ,  H01L23/13 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/32 ,  H01L23/04 ,  H01L23/13 ,  H01L23/562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/19106 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/10155 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.

Abstract translation: 为了提供吸收由冲击引起的应力的部件安装基板和部件安装结构，或者基板和部件之间的热延伸系数的差异，而不增加将基板和部件焊接在一起所需的精度。 要安装有具有一个或多个焊接点的部件的基板，部件连接到基板上，其部件形成在其部件侧上，其上设置有一个或多个电极以紧密连接 与焊点。 凹陷部分填充有与构成基体的材料的刚性不同的填充材料，使得填充材料与基材的部件侧的表面齐平或几乎齐平。

公开(公告)号：US07835159B2

公开(公告)日：2010-11-16

申请号：US11892930

申请日：2007-08-28

Applicant: Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

Inventor： Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K1/0269 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  Y10T29/49126

Abstract: A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

Abstract translation: 第二构件叠置在第一构件上。 在第一构件的表面上描述第一识别标记。 在第二构件的表面上描述第二识别标记。 当第二构件叠置在第一构件上时，第一识别标记沿第二构件的边缘分段。 第二识别标记在第二构件的边缘处结束。 第二识别标记与用于建立预定几何图案的第一识别标记协作。 第一和第二识别标记的相对位置可以基于不规则或未成形的几何图案来调整。 因此，第二构件能够可靠地以正确的位置重叠在第一构件的表面上。

公开(公告)号：US20080101048A1

公开(公告)日：2008-05-01

申请号：US11892930

申请日：2007-08-28

Applicant: Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

Inventor： Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/361 ,  H05K1/0269 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  Y10T29/49126

Abstract: A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

Abstract translation: 第二构件叠置在第一构件上。 在第一构件的表面上描述第一识别标记。 在第二构件的表面上描述第二识别标记。 当第二构件叠置在第一构件上时，第一识别标记沿第二构件的边缘分段。 第二识别标记在第二构件的边缘处结束。 第二识别标记与用于建立预定几何图案的第一识别标记协作。 第一和第二识别标记的相对位置可以基于不规则或未成形的几何图案来调整。 因此，第二构件能够可靠地以正确的位置重叠在第一构件的表面上。

公开(公告)号：US07321099B2

公开(公告)日：2008-01-22

申请号：US10921196

申请日：2004-08-19

Applicant: Kinuko Mishiro

Inventor： Kinuko Mishiro

IPC: H05K1/16

CPC classification number: H01L24/32 ,  H01L23/04 ,  H01L23/13 ,  H01L23/562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/19106 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/10155 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.

Abstract translation: 为了提供吸收由冲击引起的应力的部件安装基板和部件安装结构，或者基板和部件之间的热延伸系数的差异，而不增加将基板和部件焊接在一起所需的精度。 要安装有具有一个或多个焊接点的部件的基板，部件连接到基板上，其部件形成在其部件侧上，其上设置有一个或多个电极以紧密连接 与焊点。 凹陷部分填充有与构成基体的材料的刚性不同的填充材料，使得填充材料与基材的部件侧的表面齐平或几乎齐平。