Abstract:
In accordance with this disclosure, there are provided several inventions, including a substrate processing apparatus with multi-layer surfaces configured to face the plasma and resist against corrosion. These multi-layer surfaces may in one example include a base layer of aluminum, anodized aluminum, or quartz, a second layer of stabilized zirconia, and a second layer of a yttrium-aluminum composite such as yttrium aluminum garnet (YAG).
Abstract:
A method for forming a ceramic object from a ceramic powder is provided. The ceramic powder is placed in a press. Pressure is applied to the ceramic powder with a pressure to cause consolidation of the ceramic powder. Ultrasonic energy is applied to the ceramic powder for at least a period of time during the applying pressure to the ceramic powder, forming the ceramic powder into a ceramic object. The applying pressure to the ceramic powder is ended.
Abstract:
A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.