公开(公告)号：US4955131A

公开(公告)日：1990-09-11

申请号：US358316

申请日：1989-05-30

Applicant: Louis Edmond Chall, Jr.

Inventor： Louis Edmond Chall, Jr.

IPC: G01R31/3185 ,  G11C29/00 ,  H01L23/13 ,  H01L23/473 ,  H01L23/52 ,  H01L23/538 ,  H05K1/00 ,  H05K1/14 ,  H05K3/34 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/52 ,  G01R31/318505 ,  G11C29/006 ,  H01L23/13 ,  H01L23/473 ,  H01L23/5385 ,  H05K3/3442 ,  H05K7/20545 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/3011 ,  H05K1/0286 ,  H05K1/142 ,  H05K2201/09181 ,  H05K2201/09418 ,  H05K2201/1053 ,  H05K2201/10727 ,  H05K3/403 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126

Abstract: A novel packaging system for VLSI circuits allows low-cost construction and maintenance of complex high density high-performance devices with low power requirements. The devices can be individually created by software means from a small selection of standardizable IC chips by disposing a plurality of chips in leadless chip carriers in a mosaic on a substrate, and configuring them by software to selectively communicate with other chips of the mosaic or even to individually change their operating function. The immediate juxtaposition of the chip carriers in the mosaic eliminates transmission line data skew, and also allows considerable savings in chip space and power requirements by dispensing with interconnection drivers, receivers and bonding pads. The chip carrier mosaics may be assembled into modules suitable for plug-in connection to an interconnecting backplane to create even larger devices, and individual modules can be dynamically tested in their high-performance mode by configuring one or more modules as test modules and either plugging them into modules to be tested or making them a permanent part of the device's module array.

Abstract translation: 用于VLSI电路的新型封装系统允许低成本构建和维护具有低功耗要求的复杂高密度高性能器件。 这些设备可以通过软件方式从小型可标准化的IC芯片中单独创建，通过在基板上的马赛克中的无引线芯片载体中布置多个芯片，并且通过软件来配置它们以选择性地与马赛克的其他芯片进行通信 单独改变其操作功能。 芯片载体在马赛克中的并行排列消除了传输线数据偏移，并且还通过分配互连驱动器，接收器和接合焊盘来大大节省芯片空间和功率需求。 芯片载体马赛克可以组装成适合于插入连接到互连背板的模块，以创建更大的设备，并且可以通过将一个或多个模块配置为测试模块和插件来以高性能模式动态测试各个模块 它们被组合成要测试的模块或使其成为设备模块阵列的永久部分。