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    METHOD AND APPLICATIONS OF THIN-FILM MEMBRANE TRANSFER
    1.
    发明申请
    METHOD AND APPLICATIONS OF THIN-FILM MEMBRANE TRANSFER 有权
    薄膜转移的方法与应用

    公开(公告)号：US20150311664A1

    公开(公告)日：2015-10-29

    申请号：US14541071

    申请日：2014-11-13

    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Apoorva MURARKA ,  Annie I-Jen WANG ,  Wendi CHANG

    IPC: H01S3/106 ,  H01S3/0941 ,  H01S3/07 ,  G02B26/00 ,  H01S3/16 ,  H01S3/13 ,  H01S3/105 ,  H01S3/0933 ,  H01S3/08

    CPC classification number: H01S3/1053 ,  B81B2201/02 ,  B81B2201/042 ,  B81C1/00158 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L1/24 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  H01L29/84 ,  H01S3/07 ,  H01S3/08059 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/106 ,  H01S3/1305 ,  H01S3/16 ,  H01S3/1693

    Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

    Abstract translation: 本公开涉及在无溶剂环境中微机电系统（“MEMS”）的微接触印刷的方法和装置。 所公开的实施方案使得能够在聚对二甲苯层上形成复合膜并将复合结构转移到接收结构以形成由复合膜覆盖的一个或多个微腔。 聚对二甲苯膜的厚度可以在约100nm-2微米的范围内; 200nm-1微米，200-300nm，300-500nm，500nm至1微米和1-30微米。 接下来，在聚对二甲苯之上形成一个或多个二次层以产生复合膜。 复合膜可以具有约100nm至700nm至几微米的厚度。 可以测量复合膜的响应于外力的偏转，以提供无接触检测器。 相反，可以使用外部偏压来致动复合膜，以产生与施加的偏压相称的偏转。 所公开的实施例的应用包括可调激光器，麦克风，微型扬声器，远程激活的无接触压力传感器等。

    BOTTOM-UP ULTRA-THIN FUNCTIONAL OPTOELECTRONIC FILMS AND DEVICES
    3.
    发明申请
    BOTTOM-UP ULTRA-THIN FUNCTIONAL OPTOELECTRONIC FILMS AND DEVICES 审中-公开
    底部超薄功能光电膜和器件

    公开(公告)号：US20150228916A1

    公开(公告)日：2015-08-13

    申请号：US14608504

    申请日：2015-01-29

    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    Inventor： Vladimir BULOVIC ,  Joel JEAN ,  Annie I-Jen WANG

    IPC: H01L51/00 ,  H01L51/44

    CPC classification number: H01L51/0097 ,  H01L51/003 ,  H01L51/0046 ,  H01L51/0056 ,  H01L51/448 ,  H01L2251/308 ,  Y02E10/549 ,  Y02P70/521

    Abstract: The embodiments disclosed herein are directed to optoelectronic devices based, on ultra-thin, lightweight and in-situ deposited parylene substrates, as well as methods of manufacture. Using a bottom-up approach, a readily releasable parylene thin film can be used for fabricating thin film electronic and optoelectronic systems on the thin and light substrates having thicknesses in the nanometer to low micron range. The disclosed method enables the integration of forming a parylene substrate with, the fabrication of a complete photovoltaic device under a fully contained, controlled environment.

    Abstract translation: 本文公开的实施例涉及基于超薄，轻质和原位沉积的聚对二甲苯基板以及制造方法的光电子器件。 使用自下而上的方法，易于释放的聚对二甲苯薄膜可用于在具有纳米至低微米范围的厚度的薄且轻的基底上制造薄膜电子和光电子系统。 所公开的方法使得能够在完全包含的受控环境下整合形成聚对二甲苯衬底，制造完整的光伏器件。

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