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    METHOD AND APPLICATIONS OF THIN-FILM MEMBRANE TRANSFER
    1.
    发明申请
    METHOD AND APPLICATIONS OF THIN-FILM MEMBRANE TRANSFER 有权
    薄膜转移的方法与应用

    公开(公告)号：US20150311664A1

    公开(公告)日：2015-10-29

    申请号：US14541071

    申请日：2014-11-13

    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY

    Inventor： Vladimir BULOVIC ,  Jeffrey Hastings LANG ,  Apoorva MURARKA ,  Annie I-Jen WANG ,  Wendi CHANG

    IPC: H01S3/106 ,  H01S3/0941 ,  H01S3/07 ,  G02B26/00 ,  H01S3/16 ,  H01S3/13 ,  H01S3/105 ,  H01S3/0933 ,  H01S3/08

    CPC classification number: H01S3/1053 ,  B81B2201/02 ,  B81B2201/042 ,  B81C1/00158 ,  B81C1/00634 ,  B81C2201/0194 ,  G01L1/24 ,  G01L9/0005 ,  G01L9/0072 ,  G01L11/02 ,  G02B26/001 ,  H01L29/84 ,  H01S3/07 ,  H01S3/08059 ,  H01S3/0933 ,  H01S3/094 ,  H01S3/0941 ,  H01S3/106 ,  H01S3/1305 ,  H01S3/16 ,  H01S3/1693

    Abstract: The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.

    Abstract translation: 本公开涉及在无溶剂环境中微机电系统（“MEMS”）的微接触印刷的方法和装置。 所公开的实施方案使得能够在聚对二甲苯层上形成复合膜并将复合结构转移到接收结构以形成由复合膜覆盖的一个或多个微腔。 聚对二甲苯膜的厚度可以在约100nm-2微米的范围内; 200nm-1微米，200-300nm，300-500nm，500nm至1微米和1-30微米。 接下来，在聚对二甲苯之上形成一个或多个二次层以产生复合膜。 复合膜可以具有约100nm至700nm至几微米的厚度。 可以测量复合膜的响应于外力的偏转，以提供无接触检测器。 相反，可以使用外部偏压来致动复合膜，以产生与施加的偏压相称的偏转。 所公开的实施例的应用包括可调激光器，麦克风，微型扬声器，远程激活的无接触压力传感器等。

    ELECTROSTATIC ACOUSTIC TRANSDUCER
    3.
    发明申请
    ELECTROSTATIC ACOUSTIC TRANSDUCER 审中-公开

    公开(公告)号：US20180352338A1

    公开(公告)日：2018-12-06

    申请号：US15956736

    申请日：2018-04-18

    Applicant: Massachusetts Institute of Technology

    Inventor： Apoorva MURARKA ,  Vladimir BULOVIC ,  Jeffrey H. LANG

    IPC: H04R19/02 ,  H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  B81C99/00

    Abstract: Briefly, in accordance with one or more embodiments, an electrostatic acoustic transducer comprises a substrate comprising a first material to function as a first electrode, a dielectric layer coupled with the first material, wherein the dielectric layer has one or more cavities formed therein, and a membrane coupled with the dielectric layer to cover one or more of the one or more cavities and to function as a second electrode. The electrostatic acoustic transducer generates an acoustic wave in response to an electrical signal applied between the first electrode and the second electrode, wherein the applied electrical signal comprises a direct-current (dc) bias voltage and one or more time-varying electrical signals.

    ELECTROSTATIC ACOUSTIC TRANSDUCER UTILIZED IN A HEARING AID OR AUDIO PROCESSING SYSTEM
    5.
    发明申请
    ELECTROSTATIC ACOUSTIC TRANSDUCER UTILIZED IN A HEARING AID OR AUDIO PROCESSING SYSTEM 审中-公开

    公开(公告)号：US20180367921A1

    公开(公告)日：2018-12-20

    申请号：US15956740

    申请日：2018-04-18

    Applicant: Massachusetts Institute of Technology

    Inventor： Apoorva MURARKA ,  Vladimir BULOVIC ,  Jeffrey H. LANG

    IPC: H04R25/00 ,  H04R19/02

    Abstract: Briefly, in accordance with one or more embodiments, a hearing aid comprises a housing and an audio processing system disposed in the housing, the audio processing system comprising at least one amplifier, an earbud formed as part of the housing or coupled to the housing to fit into an external acoustic meatus or ear canal of a user, one or more microphones coupled to an input of the amplifier, and one or more drivers coupled to an output of the amplifier to reproduce an amplified version of an input acoustic wave impinging on the one or more microphones. The audio processing system including a processor coupled between the microphone and the driver, wherein the processor is to provide one or more hearing correction functions. At least one of the one or more drivers or the one or more microphones, or a combination thereof, comprises an electrostatic acoustic transducer.

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